MIPS Technologies Joins TSMC IP Alliance
October 11, 2010 -- MIPS Technologies, Inc. has joined the TSMC (Taiwan Semiconductor Manufacturing Company) Soft IP Alliance Program to speed customers' time-to-market. Through the Soft IP Program, TSMC is expected to provide specific design documents and technology information so that MIPS and other Alliance partners can optimize IP cores for TSMC's process technologies. The companies will also collaborate on roadmap alignment to expedite IP readiness.
"By sharing design, technology and roadmap information with TSMC, we can drive toward closer alignment and speed development for our many customers who work with TSMC on chip fabrication," said Art Swift, Vice President of Marketing and Business Development, MIPS Technologies.
"The combination of TSMC's technologies and manufacturing capability with MIPS Technologies' soft IP cores will enable customers to gain early insight into the power, performance and area trade-offs inherent in their SOC designs. This is an increasingly critical factor in meeting time-to-market objectives," said Dan Kochpatcharin, Deputy Director, IP Portfolio Marketing at TSMC.
TSMC's new Soft IP Program enriches TSMC's IP alliance portfolio, encourages soft IP innovation and reuse through TSMC's Open Innovation Platform initiative, and aims to deliver power, performance and area optimization that is important at advanced technology nodes.
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.