Tensilica Baseband DSPs and DPUs Power LTE/ HSPA/ 3G Multimode Modem IC from NTT DOCOMO
February 27, 2012 -- Tensilica, Inc. today announced that the second-generation multi-mode LTE/ HSPA/ 3G (Long Term Evolution) baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP (digital signal processor) and the ConnX BBE16 Baseband DSP. As with the first-generation NTT DOCOMO-sponsored design, this chip was co-developed by industry leaders Fujitsu, Panasonic and NEC.
First-general LTE smartphones, tablets and dongles incorporating Tensilica DPUs were introduced starting at the end of 2010 and include Fujitsu's Arrows X LTE F-05D Smartphone and Arrows' Tab LTE F-01D tablet. More LTE-based smartphones, tablets and dongles powered by Tensilica are being introduced at the Mobile World Congress show in Barcelona.
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.