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On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage DesignsSponsor: X-FAB Semiconductor Foundries AG March 7, 2012 -- Electrostatic discharge (ESD) is a serious threat to integrated circuits (ICs) that can cause irreversible damage. Join X-FAB for a free webinar on ESD protection to learn how to eliminate ESD threats in complex analog/mixed-signal and high-voltage designs. This webinar presents an overview of various ESD protection concepts, and explains the structures and schemes available to protect against electrostatic discharge in X-FAB's enhanced 0.35- and 0.18-µm XH035 and XH018 high-voltage foundry processes. It examines behavior, layout and application requirements. It also highlights similarities and differences among ESD protection concepts, outlining the advantages and disadvantages of each in circuit designs. | |
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information. | |