Cypress USB3.0 Solution with Altera FPGA Evaluation Kit
Sponsor: Cypress Semiconductor Corp.
June 27, 2012 -- In this webinar, you will get insights into hidden technical trade-offs and costs associated with current interfaces between image sensors, FPGAs and host processors in your imaging, machine-vision or data-acquisition system. You will then learn about an industry solution that has emerged to address these challenges: USB 3.0 SuperSpeed.
What attendees will learn
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.