Cypress USB3.0 Solution with Altera FPGA Evaluation Kit

Sponsor: Cypress Semiconductor Corp.
Webcaster: EE Times Education & Training

June 27, 2012 -- In this webinar, you will get insights into hidden technical trade-offs and costs associated with current interfaces between image sensors, FPGAs and host processors in your imaging, machine-vision or data-acquisition system. You will then learn about an industry solution that has emerged to address these challenges: USB 3.0 SuperSpeed.

What attendees will learn

  • Common interfaces used in imaging, machine vision and data acquisition systems.
  • Technical trade-offs with these interfaces and the problems they cause: data compression and decompression issues, needs for extra glue logic, wasted processing power.
  • The USB 3.0 SuperSpeed solution to these challenges.
  • Trade-offs between various USB 3.0 SuperSpeed solutions (FPGA + PHY, FGPA + Peripheral Controller, etc.).

Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.
Copyright 2002 - 2011 Tech Pro Communications, 1209 Colts Circle, Lawrenceville, NJ 08648