August 9, 2012 -- STMicroelectronics has unveiled its smallest, lowest-power and highest-performance chip-scale gyroscope for advanced motion-sensing applications.
ST's L3GD20H gyroscope measures only 3x3x1mm. Occupying little over half the volume of its predecessor, yet offering better resolution, higher accuracy, superior stability and faster response time, the new device enables smaller sensing mechanisms in smart consumer electronics, including mobile phones and tablets, game consoles, digital cameras and industrial tools.
The ultra-small dimensions of this gyroscope also allow experimental projects such as wearable electronics to move closer towards true practicality. One such application is the prototype smart suit that ST used to demonstrate inertial body-motion reconstruction early in 2012, which can help enhance various applications such as augmented reality, sports training aids, or medical therapy.
"Miniaturized, low-power sensors such as our new L3GD20H enable smart electronics to be used in ever-smaller and slimmer handheld devices, as well as in items such as clothes or sports equipment, creating opportunities for exciting new products and services," said Roberto De Nuccio, Business Development Manager for ST's Motion MEMS Division. "Both high-volume applications in smart phones and tablets and emerging applications such as prosthetics, medical instruments, goods tracking and power tools will benefit from this latest generation of tiny MEMS devices."
In addition to enabling advanced product miniaturization, ST's L3GD20H also helps conserve battery power by drawing 25% lower current than the previous generation of devices. The L3GD20H is also ready for action in only one-fifth of the time after turn on, enabling the end-user application to deliver a better overall experience. Finally, the gyroscope's output has 60% lower noise, which can help to simplify hardware and software design and speed up communication with the host system leading to faster application performance.
The new gyroscope retains a similar register structure as its predecessor (L3GD20), making it easy for designers to reuse existing software code and thus reduce time to market and lower development costs. Designers will also benefit from ST's Sensor Fusion development environment.
Major features
- 3x3x1-mm package equaling smallest in industry today; 25% lower current draw, 60% lower output noise, 80% faster turn-on.
- Three selectable full-scale ranges (245/ 500/ 2000 dps).
- I2C/SPI two-line digital interface.
- Integrated low- and high-pass filters with user-selectable bandwidth.
- Power-down and sleep modes.
- Embedded temperature sensor and FIFO.
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Availability
The L3GD20H, housed in the LGA-16 leadless surface-mount package, is scheduled to begin sampling in Q3 2012 and to enter mass production in Q4 2012 priced at $2.60 in quantities of 1,000 units.
Posted by: John Miklosz
Go to the STMicroelectronics website to find additional information.
