In today's fast-paced environment with short time-to-market requirements, it has become increasingly important to design products that allow for early fault and failure detection. The earlier a mistake or a defect can be detected in the design phase or in the production process, the less money it will cost to remedy it and the sooner the product will be ready for production or shipment. Therefore, a good design-for-test (DFT) strategy is needed for the design, prototype and production phase of a product.
In this document, DFT will be looked at more closely for printed circuit boards (PCB) designs utilizing boundary-scan tools in particular. One chapter is also devoted to the combination of boundary-scan with other test strategies such as in-circuit testers (ICT), flying probes and automated optical inspection (AOI).