SOCcentral: IBM Corp. (406)

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Wednesday, May 22, 2013

IBM Corp.

Address: 1133 Westchester Ave.
White Plains, NY 10604 USA
Website: www-03.ibm.com/technology/ges/semiconductor/

IBM Microelectronics products and services go beyond traditional ASIC with the capability of providing multiple variations of the design chain in a matrix of choices. From IP to tools to methodology, the goal is to provide customers with flexible, cost-effective solutions while maintaining all the value of an IBM ASIC solution.

Articles Online
Embedded Symmetric MultiProcessing System On a SoC with 1.6GHz PowerPC IP in 45nm	3/4/2010
Designing with Hard Power Constraints	1/15/2004
Diagnostics for Design Validation	3/25/2003
Speed with Flexible Design Critical to Embedded DRAM for SoCs	3/18/2003
Moving to the GHz Plus Range in SoC Design?	2/10/2003

Tutorials, White Papers, etc.
Automatic Formal Verification of Fused-Multiply-Add FPUs
Effcient Symbolic Simulation via Dynamic Scheduling, Don't Caring, and Case Splitting
Enabling Large-Scale Pervasive Logic Verification through Multi-Algorithmic Formal Reasoning
Exploiting Constraints in Transformation-Based Verification
Exploiting Suspected Redundancy without Proving It
Scalable Automated Verification via Expert-System Guided Transformations
Scalable Compositional Minimization via Static Analysis
Scalable Sequential Equivalence Checking Across Arbitrary Design Transformations

Webcasts
How to Capture the Hidden Value within Your Engineering Data	9/11/2012
Six Ways to Accelerate Android Mobile Application Development	11/10/2010
Build Smart Products: Deliver Innovation with Multicore	5/18/2010
Agile Model-Driven Development for Real-Time and Embedded Systems	3/16/2010
Support Variability In Your Architecture and Improve Your Reuse Strategy Using Model-driven Development	3/2/2010

News
IBM Expands Power Architecture Licensing	9/6/2011
IBM and ARM to Collaborate on Advanced Semiconductor Technology for Mobile Electronics	1/17/2011
IBM and Samsung Announce Joint Research into New Semiconductor Technology	1/13/2011
MOSAID and IBM Sign Patent License Agreement, Resolve Patent Litigation Suit	12/20/2010
Semtech and IBM Join Forces to Develop High-Performance Integrated ADC/DSP Platform Using 3D TSV Technology	12/9/2010
IBM, Samsung, GlobalFoundries and STMicroelectronics to Synchronization Fabs Based on IBM Technology Alliance 28-nm Process Technology	6/23/2010
Cadence and IBM Team to Develop Leading-Edge IP	5/24/2010
IBM Announces Highest-Performance Embedded Processor for SOC Designs	9/16/2009
IBM Technology Alliance Announces Availability of Advanced 28-nm, Low-Power Semiconductor Technology	4/17/2009
ARM, Chartered, IBM and Samsung Collaborate to Enable Energy-Efficient 32-nm and 28-nm SOC	9/29/2008
IBM and Mentor Graphics to Develop 22-nm Computational Lithography Solution	9/18/2008
IBM Develops Computational Scaling Solution for Next Generation 22-nm Semiconductors	9/18/2008
IBM and NEC Electronics Sign Agreement for Joint Development of Next-GenerationProcess Technology	9/12/2008
IBM Builds World's Smallest SRAM Memory Cell	8/18/2008
IBM Alliances Deliver Easier Path to Next-Generation Semiconductor Products	12/12/2007
Nokia Siemens Networks Partners with IBM on R&D Center Activities	9/28/2007
STMicroelectronics and IBM to Collaborate on Chip Technology	7/24/2007
IBM Delivers Chip Technology Innovations to Market	6/5/2007
IBM, Chartered and Samsung Extend Integrated DFM Support for Common Platform Technology to 45nm	6/4/2007
IBM Unveils World's Fastest Chip in Powerful New Computer	5/23/2007
IBM, Chartered, Samsung, Infineon and Freescale Expand Technology Agreements	5/23/2007
Cadence Aligns with IBM to Accelerate ASIC Design with Cadence Logic-Design Team Technology	11/13/2006
IBM Strengthens Power Architecture with New Low-Power Processors	10/3/2006
IBM, Chartered, Infineon and Samsung Announce Process and Design Readiness for Silicon Circuits on 45-nm Low-Power Technology	8/30/2006
IBM and Georgia Tech Break Silicon Speed Record	6/20/2006
Rapport Previews New Energy Efficient Chip Design	4/7/2006
CoWare Adds IBM PPC750GX/GL Processor Support Package to SystemC-based Model Library	4/4/2006
IBM, Sony, Toshiba Broaden and Extend Successful Semiconductor Technology Alliance	1/12/2006
IBM Takes Next Step in Opening Power Architecture to Research and Education Community	12/14/2005
Linux Extensions, Key Software Development Tools Released for Cell Broadband Engine Microprocessor	11/9/2005
IBM Delivers Power-based Chip for Microsoft Xbox 360 Worldwide Launch	10/25/2005
IBM Announces Next Generation Silicon Germanium Technology	8/5/2005
IBM Announces New CMOS Image Sensor Foundry Offering	7/13/2005
Magma Licenses IBM Physical Synthesis and Routing Technology	7/6/2005
Mercury Computer Systems Teams with IBM to Build Cell Processor-Based Systems	6/28/2005
Synopsys and IBM Announce Availability of Fully Synthesizable PowerPC Cores and SystemC Models	6/8/2005
Magma Developing 65-nm Quartz DRC Runset for IBM Processes	6/6/2005
IBM to Offer Statistical Timing Solutions for Chip Designers	6/3/2005
IBM, Chartered Extend 90-Nanometer Common Platform with Low-Power Design Solutions, High-Speed Connectivity Cores	5/25/2005
Samsung Joins IBM and Chartered on 90-Nanometer Common Design-Enablement Platform	5/24/2005
IBM and Chartered Extend Technology Development Agreement to 45 Nanometer	1/24/2005
Tahoe RF Semiconductor Validated as "Ready for IBM Technology" for Additional IBM Technologies	1/3/2005
Cadence Joins with IBM to Launch Power.org	12/1/2004
IBM, Chartered Expand 90nm Joint Design Enablement Program, Enhance Foundry Compatibility with Key EDA Support	5/24/2004
Magma Announces Formal Verification Product Quartz Formal, Based on IBM Technology	4/22/2004
IBM, Chartered Create Cross-Foundry Design Enablement Program	3/24/2004

Go directly to IBM Corp. for more company and product information.

Keywords: IBM, EDA, design services, foundry, Formal Analysis (RTL), Synthesis (RTL), Interoperability, Design Exploration & Simulation (ESL),

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