Rambus logic interface products, called RaSer, comprise application-proven interfaces that enable high-speed, chip-to-chip communications between logic chips, and offer physical layer solutions compatible with a number of industry standards used in computers and network communications.

Articles Online
Signal and Power Integrity Limitations for Mobile Memory In 3D Packaging: Part 2	10/25/2010
Signal and Power Integrity Limitations for Mobile Memory In 3D Packaging: Part 1	9/25/2010
Module Threading Technique to Improve DRAM Power and Performance	2/3/2010
How Memory Architectures Affect System Performance	1/31/2005

Tutorials, White Papers, etc.

Challenges and Solutions for Future Main Memory

News
Rambus Unveils Binary Pixel Technology for Dramatically Improved Image Quality in Mobile Devices	2/25/2013
Rambus and LSI Corporation Sign Patent License Agreement	2/20/2013
Rambus and GlobalFoundries Collaborate to Develop IP Portfolio for 14nm-XM FinFET Process Technology	2/5/2013
Rambus Introduces R+ LPDDR3 Memory Architecture Solution	1/28/2013
Rambus Unveils Imerz, an End-to-End Interactive Multi-Media Platform	1/7/2013
Rambus and ITRI Collaborate to Develop Interconnect and Advanced 3D-Packaging Technologies	12/15/2011
Rambus Develops New Clocking Technology for Power Reduction in High-Speed Interfaces	6/15/2011
Rambus Signs Patent License Agreement with Toshiba	3/16/2011
Rambus Acquires Patents and Technology from Imagine Designs	1/25/2011
Rambus and Renesas Electronics Sign Patent License Agreement	12/27/2010
Elpida and Rambus Sign Patent License Agreement	12/7/2010
Rambus and NVIDIA Sign Patent License Agreement	8/17/2010
Rambus Introduces High-Performance DDR3 Memory Controller Interface Solution for Consumer Electronics	7/28/2010
Rambus Unveils Mobile XDR Memory for Next-Generation Mobile Products	2/8/2010
Rambus Achieves Power Efficiency Breakthrough for Mobile Memory Solutions	10/22/2009
Rambus and Kingston Co-Develop Threaded Module Prototype for Multicore Computing	9/21/2009
Rambus 7.2-Gbps XDR Memory System Uses 40% Less Power than GDDR5 System	6/24/2009
Rambus Unveils New Innovations for Main Memory	5/27/2009
Rambus Acquires Inapac Patents	4/9/2009
CoWare and Rambus Announce Unique ESL Architecture Design Environment for Rambus' XDR Memory Architectue	2/10/2009
Rambus Implements XDR Memory Interface in Ultra Low-Cost Package	2/4/2009
Rambus Announces Mobile Memory Initiative	2/3/2009
Rambus DDR3 Interface Solution Selected by Panasonic	1/8/2009
Qimonda Starts Volume Production of Rambus XDR DRAM for PlayStation3	8/28/2008
Magma Titan Analog Migration Solution Ports Rambus Custom Designs	8/25/2008
Rambus Announces IBM to License Multi-Protocol SerDes	4/25/2008
Rambus Signs Memorandum of Understanding with Spansion	4/25/2008
Rambus Unveils Terabyte Bandwidth Initiative	11/27/2007
Rambus Introduces Memory Controller Interface Solution for Industry-Standard DDR3 DRAM	10/16/2007
Elpida Introduces Fastest DRAM Based on Rambus XDR Memory Architecture	10/8/2007
Rambus and Cadence Collaborate on PCI Express Solutions	9/4/2007
Rambus XDR Memory Architecture Adopted in Texas Instruments DLP Projector System	6/19/2007
Rambus and TES Electronic Solutions Sign Joint Marketing Agreement	4/17/2007
Rambus Unveils Low Power Initiative for Multi-Gbps Platforms	2/12/2007
Rambus and Spansion Sign Patent License Agreement	1/11/2007
Rambus Signs Memorandum of Understanding with Intel	1/7/2007
Qimonda and Rambus Sign Technology License for XDR DRAM	1/3/2007
Rambus Technology Adopted in Playstation3 Computer Entertainment System	11/30/2006
Rambus India High-Speed I/O Design Team Achieves First Silicon Success	11/17/2006
Toshiba Licenses Rambus XDR Memory and PCI Express Interface Solutions	10/11/2006
Ramtron Extends Serial Memory Portfolio with New 512kbit FRAM	9/6/2006
Toshiba and Rambus Sign Patent License Agreement	7/5/2006
Fujitsu and Rambus Sign Patent License Agreement Covering Systems and Semiconductors	3/21/2006
IBM and Rambus Sign Technology License Agreement for Cell Broadband Engine-Based Processors and Companion Chips	3/20/2006
Enigma Semiconductor Licenses Rambus' Advanced Backplane Technology	2/7/2006
Rambus Introduces New Decision Feedback Equalization Technology	2/6/2006
Rambus Signs Patent License Agreement with AMD	1/4/2006
Rambus Adopts Register Description Language and Licenses Denali's Blueprint Software for IP Development Process	12/15/2005
SiS Selects Rambus PCI Express PHY Solutions for its PC Chipset Products	10/27/2005
Rambus Signs Patent License Agreement with Renesas Electronics	9/29/2005
Rambus and UMC Expand Availability of Rambus PCI Express PHY IP	8/23/2005
Teradici Selects Rambus XDR Memory Interface	8/22/2005
Rambus Announces Fully Integrated, Optimized PCI Express Solution	8/8/2005
QLogic Incorporates Rambus PCI Express Digital Controller in 4G Fibre Channel ASICs	7/8/2005
Rambus Unveils Next Generation XDR Memory Interface	7/7/2005
Rambus PCI Express PHY IP on Fujitsu 90nm CMOS Process	7/5/2005
Rambus Technology Provides Unprecedented Bandwidth to Sony's PLAYSTATION 3	5/16/2005
Cadence PCI Express Solution Passes PCI-SIG Compliance Testing	4/25/2005
Rambus Acquires Digital Core IP from GDA Technologies	4/21/2005
IDT Selects Rambus PCI Express Serial Interfaces for Its Family of Bridging and Switching Solutions	4/20/2005
Rambus Signs Patent License Agreement with NEC Electronics	4/14/2005
Rambus Unveils Micro-Threading in DRAM Cores	4/4/2005
Open-Silicon Licenses Multiple RaSer Serial Link Cells Under the Cadence-Rambus Reseller Program	3/22/2005
Infineon Technologies and Rambus Conclude Broad Licensing Agreement	3/21/2005
Rambus Opens Design Center in Bangalore, India	3/17/2005
STMicroelectronics Licenses Rambus Serial Link Technology for Fibre Channel and PCI Express Applications	2/23/2005
Cell Processor Uses Rambus High Speed Interface Solutions	2/7/2005
Cadence and Rambus Sign Agreements to Deliver Portfolio of High-Speed Serial Link Solutions	7/15/2004
Rambus and Mentor Graphics Collaborate to Offer Interoperable PCI Express Solutions	6/28/2004
PLDApplications and Rambus Collaborate on Comprehensive PCI Express Platform	6/21/2004
Rambus Unveils Turbo PCI Express PHY Platform	6/21/2004
Rambus and Denali to Provide Complete DDR Memory Controller Design Solutions	5/13/2004
Rambus Provides DDR and GDDR Memory Controller Interface Cells and Services	5/10/2004
UMC and XGI License Rambus RaSer PHY Technology	4/8/2004
Texas Instruments Develops Clock Generators for XDR Memory Systems	2/23/2004
Toshiba Licenses Rambus PCI Express PHY Cell	2/12/2004

Go directly to Rambus, Inc. for more company and product information.