The 3D-IC Alliance is a consortium of integrated circuit designers, developers, and manufacturers. Its objective is to promote standards for three-dimensional integrated circuits (3D-ICs) in order to accelerate their availability and acceptance. Industry-wide standards would allow virtually any semiconductor vendor to implement 3D technology.
The 3D-IC Alliance plans to publish additional specifications for ICs and/or wafers that are designed to be stacked and vertically integrated. Any ICs or wafers that are processed and designed to these standards should be 3D integratable by most (if not all) Alliance members. The Alliance may also work to produce specific protocols and signaling and electrical specifications, allowing broad adoption and interchange between various die-level or wafer-level vendors.
Non-members are invited to join the 3D-IC Alliance. Membership is free!