April 27, 2011 -- As bit rates of digital systems increase, signal integrity of interconnects, transmitters and receivers drastically affects system performance. To ensure product reliability, compliance test specifications for high speed serial technologies become more complicating with multiple and yet strict measurement requirements on TDR, S parameter, and eye diagram. In this session, we introduce new Agilent ENA Option TDR, a one-box solution that provides breakthroughs to traditional measurement solutions, which enables to address digital engineers advanced access and efficiency to signal integrity design and verification. The contents are delivered with real case studies from the contemporary compliance specifications.
Go directly to the EE Times Education & Training webcast site to view this presentation. Registration may be required.
Keywords: embedded systems, embedded system design, EDA, EDA tools, electronic design automation, high-speed interconnect, signal integrity, Agilent Technologies, EE Times Education & Training
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