June 27, 2012 -- In this webinar, you will get insights into hidden technical trade-offs and costs associated with current interfaces between image sensors, FPGAs and host processors in your imaging, machine-vision or data-acquisition system. You will then learn about an industry solution that has emerged to address these challenges: USB 3.0 SuperSpeed.
What attendees will learn
Common interfaces used in imaging, machine vision and data acquisition systems.
Technical trade-offs with these interfaces and the problems they cause: data compression and decompression issues, needs for extra glue logic, wasted processing power.
The USB 3.0 SuperSpeed solution to these challenges.
Trade-offs between various USB 3.0 SuperSpeed solutions (FPGA + PHY, FGPA + Peripheral Controller, etc.).