June 27, 2012 -- In this webinar, you will get insights into hidden technical trade-offs and costs associated with current interfaces between image sensors, FPGAs and host processors in your imaging, machine-vision or data-acquisition system. You will then learn about an industry solution that has emerged to address these challenges: USB 3.0 SuperSpeed.
What attendees will learn
Common interfaces used in imaging, machine vision and data acquisition systems.
Technical trade-offs with these interfaces and the problems they cause: data compression and decompression issues, needs for extra glue logic, wasted processing power.
The USB 3.0 SuperSpeed solution to these challenges.
Trade-offs between various USB 3.0 SuperSpeed solutions (FPGA + PHY, FGPA + Peripheral Controller, etc.).
Go directly to the EE Times Education & Training webcast site to view this presentation. Registration may be required.
Keywords: embedded system design, embedded systems, computer system design, general-purpose computers, special-purpose computers, FPGAs, field programmable gate arrays, FPGA design, Universal Serial Bus, SuperSpeed USB, Cypress Semiconductor, EE Times Education & Training,
336/38686 6/27/2012 650 132
Designer's Mall
0.015625
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