| Building High-Performance SOCs with Configurable and Extensible Processors Featured |
Sponsor: Synopsys, Inc. | Webcast Date: 4/7/2011 | April 7, 2011 -- With advanced SOC designs moving to smaller process geometries, designers are requiring high-performance processor cores that are optimized for low power consumption and small silicon area. This webinar will detail how the confi ... read more |
| HDMI: Enabling 3D Revolution Featured |
Sponsor: Synopsys, Inc. | Webcast Date: 3/31/2011 | March 31, 2011 -- As the consumer electronics industry makes significant investments in developing next-generation technologies for a broad range of 3D applications, HDMI is the driving force behind enabling the 3D revolution. The latest HDMI 1. ... read more |
| New Specifications Deliver Ultra-Fast Performance and Lower Power Consumption for Mobile Devices Featured |
Sponsor: JEDEC | Webcast Date: 3/30/2011 | March 30, 2011 -- Ever-increasing consumer expectations for mobile device performance and functionality are driving a need for targeted interface and storage solutions, high data-transfer speeds and advanced power management.
MI ... read more |
| Modeling Semiconductor Reliability with TCAD Sentaurus Featured |
Sponsor: Synopsys, Inc. | Webcast Date: 3/30/2011 | March 30, 2011-- The trends in semiconductor technology toward smaller feature sizes and higher integration lead to a growing number of reliability issues whose characterization and mitigation is a fundamental part of technology development and ... read more |
| Fast-Mode Plus I2C-Bus: Adding Value to Your Designs Featured |
Sponsor: NXP Semiconductors | Webcast Date: 3/30/2011 | March 30, 2011 -- This webinar will discuss the Fast-mode Plus (Fm+) I2C interface which supports up to 1-MHz speeds and higher loading compared to Fast-mode (Fm) I2C. Trade-offs and system challenges that need considerations when designing with ... read more |
| Implementing an Embedded Memory Subsystem in Mobile Applications Featured |
Sponsor: Synopsys, Inc. | Webcast Date: 3/29/2011 | March 29, 2011 -- Successful low-power IC designs implement several power management schemes through a comprehensive design, implementation and verification tool chain that understands the power intent. These designs include a large portion of e ... read more |
| Introducing the Zynq-7000 EPP Family: ASIC-Like Features Combined with ASSP Ease of Use and FPGA Flexibility Featured |
Sponsor: Xilinx, Inc. | Webcast Date: 3/29/2011 | March 29, 2011 -- Learn more about the Xilinx Zynq-7000 family, the industry's first Extensible Processing Platform (EPP) developed to achieve the levels of processing and compute performance required in high-end embedded applications targeting ... read more |
| Introduction to the ARM Architecture Featured |
Sponsor: ARM | Webcast Date: 3/23/2011 | March 23, 2011 -- Learn about the ARM architecture and ARM-based solutions for high performance, reduced system costs, and power and energy efficiency across multiple applications such as automotive infotainment and safety, digital TVs, tablets ... read more |
| Custom Processors: The Optimum Tradeoff Between Flexibility, Power and Performance Featured |
Sponsor: Synopsys, Inc. | Webcast Date: 3/22/2011 | March 22, 2011 -- Dealing with change has become more important than ever, whether you need to support a new emerging standard or respond to new functionality that your competition just released. And, as if the drive towards more flexibility and ... read more |
| Considerations for DSP Selection and Audio Subsystem Design Featured |
Sponsor: CEVA, Inc. | Webcast Date: 3/17/2011 | March 17, 2011 -- With the growing complexity of home entertainment audio, such as very high bit-rates, loosless codecs, and advanced audio post-processing, designers of multimedia SOCs are faced with increased challenges. In addition to high pe ... read more |
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