| New Features in TCAD Sentaurus Featured |
Sponsor: Synopsys, Inc. | Webcast Date: 1/18/2011 | January 18, 2011 -- This webinar will introduce the new features in the December 2010 release of TCAD Sentaurus. Attendees will learn about Sentaurus' new capabilities in the fields of 3D structure generation, process modeling, quantization in d ... read more |
| Fundamentals of Designing with Semiconductors: Sensors and How to Use Them Featured |
Sponsor: Analog Devices, Inc. (ADI) | Webcast Date: 1/12/2011 | January 12, 2011 -- In this premiere webcast of a 12-part series on the Fundamentals of Designing with Semiconductors, we will introduce the concepts of physical signals, why and how they need to be changed into analog/ electrical signals (throu ... read more |
| Achieve Higher FPGA Design Productivity with Plug-and-Play IP Featured |
Sponsor: Xilinx, Inc. | Webcast Date: 1/11/2011 | January 11, 2011 -- Xilinx has helped to define the AXI4 interface, a common interconnect that enables designers to easily link and combined IP within an FPGA. This webcast will explain how this new IP interconnect works and how it enables plug- ... read more |
| Maximizing Cortex-M4's DSP Performance Using the LPC4300's Asymmetrical Dual-Core and Configurable Peripherals Featured |
Sponsor: NXP Semiconductors | Webcast Date: 12/16/2010 | December 16, 2010 -- With 150-MHz performance and advanced DSP instructions, NXP's Cortex-M4 based LPC4300 series combines excellent signal processing performance with all the benefits of a microcontroller including integrated interrupt control, ... read more |
| Bringing Visual Computing Alive: Details of the Mali-T604 Graphics Processor Featured |
Sponsor: ARM | Webcast Date: 12/16/2010 | December 16, 2010 -- Consumer expectations of the graphics capabilities of embedded devices is converging with requirements seen previously only on the desktop. This webinar will show what people should expect to see in up-and-coming products ra ... read more |
| PCI Express 3.0: Learn How to Perform PHY Verification to the Latest CEM and Base Specifications Featured |
Sponsor: Tektronix, Inc. | Webcast Date: 12/15/2010 | December 15, 2010 -- PCI Express is quickly moving to the third generation of higher speed and performance with PCI Express 3.0 at 8GTps. This is a significant upgrade which presents signal-integrity challenges on the physical layer for engineer ... read more |
| Building Optically Compliant High Performance Serial Links at 10G, 100G and 400G Featured |
Sponsor: Xilinx, Inc. | Webcast Date: 12/14/2010 | December 14, 2010 -- In order to meet increasing bandwidth demands, communication equipment vendors are building 40G, 100G and looking toward to the next-generation 400G systems with as few changes to the existing infrastructure as possible. Thi ... read more |
| Foundry Solution for Hall Sensor Applications Integrated Magnetic Field Sensing Made Easy with Ready-to-Use Hall Device Featured |
Sponsor: X-FAB Semiconductor Foundries AG | Webcast Date: 12/9/2010 | December 9, 2010 -- This free webinar introduces X-FAB's newly released Hall effect sensor device that detects and measures magnetic fields directly on the chip, making magnetic field-sensing design much faster. You'll learn how the Hall sensor ... read more |
| Moving Up to High-Level Synthesis Featured |
Sponsor: Cadence Design Systems, Inc. | Webcast Date: 12/8/2010 | December 8, 2010 -- High-level synthesis based on SystemC is now proven on a wide variety of leading-edge designs since it offers verification, productivity, and reuse advantages over hand-written RTL. Learn about the high-level synthesis flow, ... read more |
| System-Level Simulation Acceleration with UVM/OVM Featured |
Sponsor: Cadence Design Systems, Inc. | Webcast Date: 12/1/2010 | December 1, 2010 -- With more and more software content in chips — embedded or application level — RTL design and verification is no longer the main bottleneck to a faster tape-out schedule. System integration, including embedded software develo ... read more |
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