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 Category: Special Topics: Design for Test: Tuesday, May 21, 2013
 Design for Test

Featured Articles

Changing the Paradigm of Electrical Test

The test of electronic circuits has been a key topic in the industry since the first transistor was developed, and today it is as relevant as ever. Most of us agree that product testing is absolutely necessary: as part of design validation, as a quality indicator for manufacturing process control, or for the detection of defective products prior to shipping them to a customer. We do have certain requirements that should be met, however, by our test solutions: test development and execution should be fully automated and should be done in essentially no time, we want the test equipment to be very inexpensive, and we want a fault coverage of 100%.

Read the entire article from GOEPEL electronic GmbH on SOCcentral.

New IJTAG Standard Simplifies SOC Verification and Test Processes

Modern SOCs are a complex mix of embedded-IP cores, customized logic provided by the chip supplier and a myriad of communication interfaces. SOC designers have found that accessing instruments embedded into their chips and embedding their own instruments into their devices is the best way to test and verify that a device meets its specifications, is functioning properly and achieves its performance goals. As a result, embedded instruments have become central to SOC design-for-test (DFT), design-for-debug (DFD), design-for-manufacturing (DFM) and verification strategies (usually collectively termed DFx).

Read the entire article from ASSET InterTech, Inc. on SOCcentral.

Vendor-Independent RTL Memory BIST Insertion and Verification

ASIC vendors have traditionally incorporated built-in self-test (BIST) and repair solutions in their customers' gate-level netlists. This used to be the common industry practice for technology nodes of 65nm and older. Designers were comfortable writing in-house Perl scripts to replace memory instances with combined memory-BIST (MBIST) instances and make the necessary connections. But for more-advanced technology nodes, it is becoming common practice to share a BIST engine with multiple memories — technology permitting — and insert hierarchical BIST IP along with accurate connections. As teams design larger chips and move to more advanced nodes, the tried-and-true practices will not be as efficient.

Read the entire article from Atrenta, Inc. on SOCcentral.

The Need for a Comprehensive SOC Test Platform

Silicon test is the final arbiter that determines if an integrated circuit should be packaged and ultimately shipped to a customer or is defective and should be scrapped. Consequently, a poor test strategy and methodology can have a significant impact on the success of your product. If the test doesn't cover all possible design structures or doesn't provide high enough test coverage, then you could be unwittingly shipping bad devices (that pass the test) to your customers. If you have more tests than needed, or your test is overly constrained, your test cost could be unnecessarily eating into your profit margin. With their diverse structures and almost unfathomable complexity, a modern day system-on-chip (SOC) amplifies the challenge of developing an effective test. The need for a comprehensive test platform to address and manage these challenges has never been so tantamount to business success.

Read the entire article from Mentor Graphics Corp. on SOCcentral.

Comparing ATPG Runs

The purpose of integrated circuit test is to help segregate good devices from those that are defective to improve manufacturing yield — reducing defective parts per million to as low as 100 defective parts per million and thereby increasing shipped yield. These low-defect levels are achieved through automatic test pattern generation (ATPG) algorithms that target faults that are abstractions of defects. By making some design modifications to assist ATPG, it is possible to automate the task of targeting defect-based faults and achieve high fault coverage/efficiency with a reasonable number of test patterns.

Read the entire article from Synopsys, Inc. on SOCcentral.

Designer's Mall

SOCcentral news items about Design for Test

Integration of DeFacTo's SignOff and Real Intent's Meridian CDC Accelerates Sign-Off (5/14/2013)
Athena Introduces New Pipelined and Parallel-Pipelined Multi-Radix FFT/DFT IP Cores (4/29/2013)
Imec Teams with Cadence to Present Automated Design-for-Test Solution for 3D Memory-on-Logic (1/22/2013)
Mentor Graphics Announces Comprehensive Design Enablement Platform for Samsung's 14-nm IC-Manufacturing Process (12/24/2012)
Synopsys Introduces Memory Test and Repair Solution for Designs at 20nm and Below (11/6/2012)
STMicroelectronics Adopts Synopsys TetraMAX ATPG and Yield Explorer Tools for Rapid Yield Ramp (11/5/2012)
KALRAY Completes 256-processor, 28-nm SOC Design Using Mentor Graphics Design and Test Tools (10/23/2012)

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Magazine & Journal articles on Design for Test

Boost DFT Efficiency for Large SOCs Test & Measurement World (4/23/2013)
20-nm Test Demands New Design-for-Test and Diagnostic Strategies Tech Design Forum (11/5/2012)
Diagnostic and Repair Tools for Embedded Memory Boost SOC Yields EE Times Memory Designline (7/23/2012)
On-Chip Frequency Measurements Allow for Concurrent, Parallel, and Faster Frequency Measurements Test & Measurement World (5/9/2012)
Minimizing Yield Fallout by Avoiding Over and Under At-Speed Testing EE Times Embedded (9/30/2011)
Improving At-Speed DFT Coverage Using Early RTL Testability Analysis SOCcentral (9/20/2011)
Facilitating At-Speed Test at RTL: Part 2 EE Times EDA Designline (4/20/2011)
Facilitating At-Speed Test at RTL: Part 1 EE Times EDA Designline (4/12/2011)
SOC DFT Verification With Static Analysis and Formal Methods Test & Measurement World (11/17/2010)
Are Design and Test Conflicting or Symbiotic? Electronic Engineering Times (EE Times) (10/20/2010)
Optimizing the Manufacturing Test Program, Data Collection, and Diagnosis for Yield Analysis EE Times EDA Designline (8/31/2010)
Under the Lid: Analog Test Is Suddenly the Critical Ingredient EDN Magazine (1/7/2010)
Removing Bottlenecks from Your SOC Design-for-Test Flows EE Times EDA Designline (12/14/2009)
Debug and Testability Features for Multi-Protocol 10G SerDes Design & Reuse (3/9/2009)
Test Structures Make Designs Harder to Verify SOCcentral (10/28/2008)
Perfect Storm Brewing for Chip and Circuit Board Test SOCcentral (10/22/2008)
The Need to Address Power During Manufacturing Test EE Times EDA Designline (10/6/2008)
Electrical Fuse Makes Repairable Memory Testing Easy SOCcentral (10/5/2008)
Small Delay Defect Testing SOCcentral (10/5/2008)
Design for Low-Power Manufacturing Test EE Times EDA Designline (3/18/2008)
Complex SOC Testing with a Core-Based DFT Strategy EE Times EDA Designline (2/26/2008)
As SOCs Grow, Test-and-Measurement Instruments Move On-Chip EDN Magazine (2/21/2008)
Physically Aware Test Development EE Times EDA Designline (2/5/2008)
Design with Verification: Not an Oxymoron EE Times EDA Designline (11/5/2007)
Design for Debugging: The Unspoken Imperative in Chip Design EDN Magazine (6/21/2007)
Measuring Scan Compression Performance EE Times EDA Designline (5/21/2007)
New Techniques for Testing Communications Devices SOCcentral (11/13/2006)
Test Methods Identify Small Delay Defects EE Times EDA Designline (10/30/2006)
Strategies to Prevent IC Failures in Volume Production SOCcentral (5/18/2006)
How Much Test Compression is Enough? eeDesign (EE Times EDA News) (2/20/2006)
Tackling Test Challenges for Low-Power Design eeDesign (EE Times EDA News) (11/7/2005)
How Are You Planning to Verify all that DFT? SOCcentral (8/31/2005)
Simulation Mismatches Can Foul Up Test-Pattern Verification Electronic Design Magazine (8/4/2005)
EDA Can't Afford to Ignore Test Chips Any Longer Electronic Design Magazine (7/15/2005)
Improving Test Through Real-Time Information SOCcentral (7/1/2005)
When Probing Goes in the Chip SOCcentral (5/2/2005)
Comparing ATPG Runs SOCcentral (5/1/2005)
Generating Faster-than-at-Speed Delay Tests with On Product Clock Generation SOCcentral (5/1/2005)
High Octane ATPG SOCcentral (5/1/2005)
Why Haven't EDA Vendors Given Us DFT at the Register Transfer Level? SOCcentral (5/1/2005)
What Designers Need to Know About TCAD eeDesign (EE Times EDA News) (4/4/2005)
Take Designs from Algorithms to Artwork Chip Design Magazine (3/1/2005)
Use Co-Simulation for the Functional Verification of RTL Implementations Chip Design Magazine (3/1/2005)
"Wrap" Your Cores to Enable SoC Test eeDesign (EE Times EDA News) (11/24/2004)
Design for Volume Chip Design Magazine (11/1/2004)
How to Evaluate Test Compression Methods eeDesign (EE Times EDA News) (10/7/2004)
How Power-Aware Test Improves Reliability and Yield eeDesign (EE Times EDA News) (9/15/2004)
Delay Testing for Nanometer Chips Chip Design Magazine (9/1/2004)
At-Speed Testing Made Easy eeDesign (EE Times EDA News) (6/3/2004)
If You Can't Build It, It Isn't Worth Much EDN Magazine (4/1/2004)
Design-for-Test Links Design and Manufacturing Electronic Design Magazine (12/4/2003)
DFT Circuit Designers Battle IC, PC-Board Complexities Electronic Design Magazine (6/16/2003)
How to Generate At-speed Scan Vectors eeDesign (EE Times EDA News) (5/9/2003)
Linking Synthesis with DFT Key for Network Switch ICs Electronic Engineering Times (EE Times) (3/4/2003)
Analog Circuits Need More Than Just DFT Methods Electronic Engineering Times (EE Times) (3/3/2003)
Bandwidth Match Avoids I/O Snarl Electronic Engineering Times (EE Times) (3/3/2003)
Creating Value Through Test Electronic Engineering Times (EE Times) (3/3/2003)
DFT: A Systems Technology for System Chips Electronic Engineering Times (EE Times) (3/3/2003)
Moving DFT to RTL Overcomes Test Vector Issues Electronic Engineering Times (EE Times) (3/3/2003)
Pre-Configured DFT Structures Can Simplify ASIC Design, Verification Electronic Engineering Times (EE Times) (3/3/2003)

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Tutorials, White Papers & Application Notes on Design for Test

Already Scanned Today? GOEPEL electronic GmbH
Chip & Board Testability Assessment Checklist ASSET InterTech, Inc.
Design for Testability: The Importance of Straightforward Solutions GOEPEL electronic GmbH
Design-for-Test Guidelines Corelis, Inc.
JTAG Guidelines for Board DFT: Part 1 ASSET InterTech, Inc.
JTAG Guidelines for Board DFT: Part 2 ASSET InterTech, Inc.
JTAG/ Boundary Scan: What Can It Do for You and What Do You Have to Do? GOEPEL electronic GmbH
Nanometer Test: Methodology and Economics Cadence Design Systems, Inc.
Power-Saving Clock-Gating Technique is an Inseparable Part of SoC Design Toshiba America Electronic Components, Inc. (TAEC)
Using Boundary Scan to Link Design and Manufacturing Test ASSET InterTech, Inc.

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