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 Category: Special Topics: Floorplanning & Layout: Saturday, May 25, 2013

Featured Articles

Hard Macro Placement in Complex SoC Design

Advanced process nodes enable the implementation of highly complex system on chips (SoCs) and multimillion-gate designs such as memories, processor cores, analog circuitry, DSP cores, and PLLs. For these large, complex designs, designers are using more hard macros to help speed logic-gate placement and to alleviate some tool-capacity challenges. Most of the logic gates - and, therefore, most hard macros used to place these gates - are dedicated to memories.

To succeed in their role, physical designers must deliver a competitive product “right” to market: the right features and functionality at the right time and cost. This means that the die size (area) cannot be too large, the design cost must remain within the range of profitability, the design must operate at its target frequency, and the entire design — from concept to silicon — must be delivered on time. As a result, accurate hard macro placement can make the difference between a design success and a design failure, and is becoming mission-critical to SoC design.

In this article, we look at the challenges — and solution — to accurate hard macro placement.

Read the entire article by Synopsys, Inc. on SOCcentral.

Designer's Mall

SOCcentral news items about Floorplanning & Layout

ATopTech's Aprisa and Apogee Physical Implementation Tools Certified by TSMC for 16-nm FinFET Technology (5/22/2013)
Oasys Announces Floorplan Compiler (5/21/2013)
MagnaChip Adopts Mentor Graphics Pyxis Platform and PDK Automation Process (5/14/2013)
Si2 OpenPDK Coalition Releases ESD Design Flow Methodology (4/4/2013)
Cadence Synthesis Technology Speeds Time-to-Production for Renesas Micro Systems (11/26/2012)
ON Semiconductor Completes Multiple Tape-Outs Using Mentor Graphics' Pyxis Custom Router (11/8/2012)
ATopTech's Physical Design Solution Included in TSMC 20-nm Reference Flow (10/11/2012)
Si2 Announces Member Demonstrations at the 17th Si2 Conference (10/3/2012)
Open-Silicon Uses Synopsys IC Compiler to Achieve 1.3GHz on Quad-Core ARM Cortex-A9 MPCore Processor (10/2/2012)
Chip Path Announces SOC Architectural Assembly and Floorplanning System (6/4/2012)
Si2 Announces Six New Members of the Open3D Technical Advisory Board (5/31/2012)

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Magazine & Journal articles on Floorplanning & Layout

Accelerate Design Closure with Multi-Core Timing Analysis and Optimization SOCcentral (11/2/2009)
Layout Automation for the Next Generation of Custom Chips SOCcentral (7/6/2009)
Challenges in 45-nm Physical Design SOCcentral (11/6/2008)
Floorplanning a Power Delivery Network with Spice Electronic Design Magazine (7/24/2008)
What Floorplan Information Is Needed for Synthesis EE Times EDA Designline (4/22/2008)
Power Integrity and Energy-Aware Floorplanning SOCcentral (1/16/2008)
Using Dynamic and Static Power Rail Analysis to Maximize Results with Minimum Effort SOCcentral (6/26/2006)
Seven Habits of Effective Formal Verification Planning SOCcentral (6/12/2006)
I/O Planning Ensures IC Packaging Success eeDesign (EE Times EDA News) (1/30/2006)
Hard Macro Placement in Complex SoC Design SOCcentral (11/18/2005)
Moore’s Law and the Need for a Revolution in Floorplanning Methodology SOCcentral (10/17/2005)
Design-Planning Guidelines Prevent Chip Surprises EDN Magazine (2/5/2004)

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Tutorials, White Papers and Conference Papers on Floorplanning & Layout

Early Chip Sizing Carries High Financial and Technical Implications Toshiba America Electronic Components, Inc. (TAEC)

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