| Pirelli Chooses Altera Stratix GX Devices for Radio-Over-Fiber 3G Network Solution |
September 2, 2004 -- Pirelli has chosen Stratix GX devices from Altera Corp. for its radio-over-fiber (ROF) solution for 3G networks using the universal mobile telecommunications system (UMTS) standard. ROF enables the transmission of radio sign ... read more |
| LSI Logic Debuts SAS and SATA II Storage Adapters and Platform ASIC Methodology at Intel Developer Forum |
September 2, 2004 -- LSI Logic Corp. premieres what the company says is the only IOP-based Serial ATA (SATA) II adapter with Port Multiplier support, along with product demonstrations using Serial Attached SCSI (SAS) technology and new RapidChip ... read more |
| Samsung Semiconductor Teams with Denali to Accelerate OneNAND Flash Adoption |
September 1, 2004 -- Denali Software, Inc. and Samsung Semiconductor, Inc. have announced a collaborative effort to develop advanced verification models for Samsung OneNAND Flash devices. These advanced simulation models enable chip developers ... read more |
| Altera Introduces Stratix II Development Kits for High-Speed, DSP, and Embedded System Designs |
September 1, 2004 -- Altera Corp. has introduced a comprehensive portfolio of development kits for the latest generation of high-density FPGAs. According to the company, the portfolio, which includes a high-speed interface kit, a DSP kit, and an ... read more |
| Altera's New MAX II Development Kit Simplifies Low-Cost CPLD Design |
September 1, 2004 -- Altera Corp. has introduced the MAX II Development Kit for designers building general-purpose, low-density logic applications using Altera's low-cost MAX II CPLD family. The kit provides hardware designers with everything ne ... read more |
| AMI Semiconductor Chooses ARM for Automotive Electronics |
September 1, 2004 -- AMI Semiconductor (AMIS) and ARM today announced that AMIS has selected the ARM architecture for a new range of programmable automotive electronics solutions. AMIS has licensed two ARM7 family processors to develop industry- ... read more |
| Shanghai Research Center for IC Design and Cadence Introduce New CPU/DSP Core-Based Methodology for SOC Chips |
August 31, 2004 -- Cadence Design Systems, Inc. and the Shanghai Research Center for Integrated Circuit Design (ICC), China's national IC design industrialization base founded by China's Ministry of Science and Technology, has announced the ava ... read more |
| MegaChips Turns to MIPS for Battery-Powered Cell Phones and Digital Cameras |
August 30, 2004 -- MIPS Technologies, Inc. and MegaChips LSI Solution, Inc. (MCL) announced today that MCL has standardized upon the MIPS32 architecture for a range of battery-powered consumer electronics applications. SOCs based upon the MIPS3 ... read more |
| Lucent Technologies Selects Lattice System Chips for Next Generation Multiservice Edge Switch |
August 30, 2004 -- Lucent Technologies has selected Lattice Semiconductor Corp.'s ORSO82G5 and ORSO42G5 field programmable system chips (FPSC), as well as the ispGDX2 generic digital crosspoint switch, for use in Lucent’s next generation CBX 35 ... read more |
| Mentor Graphics and Denali Collaborate to Deliver High-Quality IP for PCI Express and Advanced Switching Interfaces |
August 30, 2004 -- Denali Software, Inc. and Mentor Graphics Corp. have announced a collaborative effort to ensure high quality and ease of deployment for the Mentor Graphics PCI Express intellectual property (IP) cores. Mentor Graphics will use ... read more |
| Xilinx Ships 90-nm Spartan-3 Devices in Volume Production |
August 30, 2004 -- Xilinx, Inc. has announced that it is shipping five members of its Spartan-3 family in volume production to over 1200 customers worldwide, including the XC3S50, XC3S200, XC3S400, XC3S1000 and XC3S1500 devices.
The 90nm ... read more |
| ISMI Symposium Offers Productivity Survival Tools to IC Makers |
August 30, 2004 -- Giving semiconductor manufacturers the 21st Century productivity tools they'll need to stay leading-edge and profitable amid turbulent economic conditions will be the focus of the ISMI Symposium on Manufacturing Effectiveness ... read more |
| Aldec Brings Mixed VHDL/Verilog/SystemC Verification to Mainstream Designers |
August 30, 2004 -- Aldec, Inc. has announced the release of Riviera 2004.08, which implements a direct kernel connection between Riviera’s mixed-language VHDL, Verilog and SystemVerilog HDL compilers and the C/C++ compiler providing a seamless ... read more |
| The MathWorks Introduces RF Design and Simulation Products for MATLAB and Simulink |
August 30, 2004 -- The MathWorks has announced the availability of the RF Blockset and the RF Toolbox, two new products designed to expand the scope of Model-Based Design for signal processing and communications engineering applications. Both pr ... read more |
| Samsung Standardizes on Synopsys DesignWare USB IP |
August 30, 2004 -- has signed a multi-year license agreement for Synopsys' DesignWare intellectual property (IP). Under the terms of the agreement, Samsung is licensing the DesignWare Cores IP portfolio, which includes the PCI Express and USB ... read more |
| ZSP Cores are "DSP of Choice" for Broadcom's Set-Top Box Audio Applications |
August 30, 2004 -- LSI Logic Corp. today announced that Broadcom Corp. has licensed the ZSP500 digital signal processor (DSP) core to service multiple encoding and decoding audio applications in the set-top box market. As an early adopter of the ... read more |
| Texas Instruments to Showcase Emerging DSP Technology and Applications at Embedded Systems Conference in Boston |
August 30, 2004 -- Texas Instruments, together with members of TI's third party network, will feature a variety of new and emerging DSP products and applications during the Embedded Systems Conference in Boston, September 13 to 16. TI will ho ... read more |
| Synopsys Introduces 90nm USB 2.0 On-The-Go PHY and Extends Its Hi-Speed USB PHY to 90nm Node |
August 30, 2004 -- Synopsys, Inc. has announced the availability of the DesignWare USB 2.0 On-The-Go (OTG) PHY (Physical Layer) Core targeted to TSMC's 90nm, 130nm and 180nm processes as well as an extension of the Hi-Speed USB 2.0 PHY Core prod ... read more |
| Cadence Accelerates Time to Market for Stretch |
August 30, 2004 -- Cadence Design Systems, Inc. has helped Stretch, Inc. meet an aggressive time-to-market goal for a high-performance software-configurable processor design. Stretch benefited from the strength of a comprehensive Cadence Digita ... read more |
| Tektronix Selects ARC 600 RISC CPU/DSP |
August 29, 2004 –- ARC International today announced that Tektronix, Inc. has licensed the ARC 600 core, the ARC MQX RTOS, MetaWare development tools, and the MetaSim co-simulation tool for use in its next-generation products.
“The ARC 600 ... read more |
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