| STMicroelectronics and ARM Announce RealView Developer Kit for 32-Bit Microcontrollers |
April 13, 2004 -- STMicroelectronics and ARM have announced the availability of the ARM RealView Developer Kit for STMicroelectronics as a complete, cost-effective development and debug product for design engineers using STMicroelectronics' ge ... read more |
| STMicroelectronics Launches Standard 32-bit ARM-based Microcontrollers |
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April 12, 2004 -- STMicroelectronics has launched a range of 16-bit/32-bit microcontrollers based on the ARM7 Thumb core family. The STR710 series is based on the ARM7TDMI core and includes embedded flash and low pin-count packages. This fami ... read more |
| TSMC Validates Magma's Capacitance Extraction Accuracy for 0.13-Micron Designs |
April 12, 2004 - -Magma Design Automation, Inc.'s Blast Fusion's built-in parasitic extraction capability has been validated by TSMC for its 0.13-micron process. The extraction capability is an integral part of Magma's RTL-to-GDSII design tool ... read more |
| The Mathworks and Mentor Graphics Win EDN Innovation of the Year Award for Link for ModelSim |
April 12, 2004 -- The MathWorks, Inc. and Mentor Graphics, Inc. announced that The MathWorks software tool Link for ModelSim won the EDN Innovation of the Year Award in the EDA: Design Exploration category. This exclusive awards program honors o ... read more |
| Synopsys Galaxy Test Solution Sets New Benchmark in Performance and Quality for Deep Submicron Designs |
April 12, 2004 -- Synopsys, Inc. has announced that the new releases of DFT Compiler and TetraMAX ATPG -- key products in Synopsys' Galaxy Test Solution -- have improved design-for-test (DFT) performance and automatic test pattern generation ( ... read more |
| Toshiba Implements 8-Million-Gate Networking Switch Using Cadence Encounter Digital IC Design Platform |
April 12, 2004 -- Cadence Design Systems, Inc. has announced that Toshiba America Electronic Components, Inc. (TAEC) has successfully implemented an 8-million-gate system-on-chip (SoC) using the Cadence Encounter digital IC design platform. The ... read more |
| Summit Design Upgrades Membership In Open SystemC Initiative to Associate Corporate |
April 12, 2004 -- Summit Design, Inc., has joined the Open SystemC Initiative as an Associate Corporate Member. Summit Design is contributing to the technical development within OSCI through its participation in the technical working groups of ... read more |
| Accellera Joins IEEE Standards Association |
April 12, 2004 -- Accellera, the electronics industry organization focused on language-based electronic design standards, has become a Corporate Member of the IEEE Standards Association (IEEE-SA) in order to take part in and shape the direction ... read more |
| UMC and XGI License Rambus RaSer PHY Technology |
April 8, 2004 -- UMC is now offering Rambus's 0.13-micron RaSer physical layer cell for PCI Express applications to its foundry customers. This partnership gives chip developers access to cost-effective, high-performance PCI Express-based inter ... read more |
| MIPS Technologies Forms Alliance with DNP to Offer SOC Design Services |
April 7, 2004 -- MIPS Technologies, Inc. and Dai Nippon Printing Co, Ltd. (DNP) have formed an alliance where DNP will provide comprehensive System on Chip (SoC) design services utilizing the MIPS32 4KE processor family and MIPS64 5Kc and 5Kf co ... read more |
| Icera Semiconductor Collaborates with Prolific for Development of Leading Edge Silicon |
April 6, 2004 -- Prolific, Inc.announced that Icera Semiconductor selected Prolific's ProGenesis software to accelerate the development of its standard cell libraries. Icera will use ProGenesis for the automated development of standard cells for ... read more |
| TSMC to Supply Products and Services for Future Microsoft Game Consoles |
April 6, 2004 -- Microsoft and Taiwan Semiconductor Manufacturing Company (TSMC) have reached an agreement for TSMC to provide semiconductor manufacturing services for Microsoft's future Xbox products. The agreement expands an ongoing relation ... read more |
| Altera Selects Silicon Highway as New Sales Representative in UK |
April 6, 2004 -- Altera Corp. has reached an agreement with Silicon Highway to support Altera's increasing sales activities within the consumer, automotive and broadcast markets in the United Kingdom. Silicon Highway's strong technical and sales ... read more |
| Cadence to Acquire Neolinear Featured |
April 6, 2004 -- Cadence Design Systems, Inc. has announced that it plans to acquire Neolinear, Inc. for its analog design technology, critical for the consumer and communications markets where semiconductors are increasingly differentiated by ... read more |
| BAE Systems Selects Magma's Characterization and Modeling Technology |
April 6, 2004 --The Silicon Correlation Division of Magma Design Automation has announced that BAE Systems Information & Electronic Warfare Systems (IEWS) has licensed the entire suite of SiliconSmart characterization products. The software tec ... read more |
| New QuickWorks V9.6 Design Tools Support uWatt Low-Power Eclipse II FPGA Family |
April 5, 2004 -- QuickLogic Corp. has announced that version 9.6 of its QuickWorks development software is now available and supports the QuickLogic Eclipse II family of FPGAs.
QuickWorks 9.6 includes the PowerAware Placer, a tool that m ... read more |
| Xilinx Offers RocketIO Design Services |
April 5, 2004 -- Xilinx, Inc. has announced the addition of Xilinx RocketIO Design Services for backplane design, high-speed modeling, and physical channel characterization to its RocketIO technology solution. RocketIO XDS expands Xilinx' tradit ... read more |
| MoSys' 1T-SRAM-Q Technology Verified on UMC'S 0.13-Micron Logic Process |
April 5, 2004 -- MoSys, Inc. and UMC have announced the successful silicon validation of MoSys' 1T-SRAM-Q (quad density) embedded memory technology on UMC's 0.13-micron logic process. This extends the existing cooperation between the companies, ... read more |
| OCP-IP and ECSI Announce Collaboration |
April 5, 2004 -- Open Core Protocol International Partnership (OCP-IP), and European Electronic Chips & Systems Design Initiative (ECSI), announce a collaboration between the two respective organizations. The agreement lets the industry organiz ... read more |
| Nassda Launches HSIMplus Platform |
April 5, 2004 -- Nassda Corp. has announced the HSIMplus platform for the comprehensive simulation and analysis of high-performance analog, mixed-signal, memory, and system-on-chip designs including important post-layout effects. The platform, ... read more |
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