February 28, 2006 -- Compal Communications, a manufacturer of mobile communication products, has chosen Freescale Semiconductor, Inc. to provide ZigBee technology for its next-generation wireless communication module. Compal engineered its communication module to meet the ZigBee and IEEE 802.1.5.4 standards and to address the need for a cost-effective, low-power wireless sensor and control network.
The flexibility and size of Compal's module allows easy integration into a number of applications for various industries. Compal supports customers on both the hardware and software to allow full ZigBee implementation. Compal's modules deliver performance and reliability that will lower the entry barriers of RF and antenna design for customers with the additional benefit of high-quality RF performance.
"Freescale's comprehensive ZigBee offerings enabled us to deliver a highly integrated wireless module that addresses a variety of emerging wireless applications," said Dr. Sam Yang from Compal Communications. "Our goal is to deliver turnkey solutions to our customers looking to add wireless connectivity, and Freescale's solutions enable new possibilities for medical, home automation and monitoring applications."
According to a report by analyst firm In-Stat published in 2005, the estimated worldwide market for ZigBee chipsets is expected to reach 150 million units by 2009.
Freescale's ZigBee-compliant platform, which includes the MC13193 2.4 GHz RF chip, a low voltage, low power HCS08 MCU and the Figure 8 Wireless Z-Stack ZigBee software, provides a robust, cost-effective, and easy-to-deploy solution. ZigBee-enabled on-chip features and enhancements reduce external components and total bill of materials, while providing battery lifetimes of up to several years.
Go to the Freescale Semiconductor, Inc. website for details.