| Apache and NEC Electronics Collaborate to Address the System-in-Package (SiP) Power Integrity Challenge |
October 3, 2006 -- Apache Design Solutions, Inc. and NEC Electronics today announced that they have collaborated to address the power integrity challenges associated with system-in-package (SiP) designs. As part of the partnership, ... read more |
| ChipX Announces USB-IF Compliance Certification for USB 2.0 HS OTG PHY in Structured ASIC |
October 3, 2006 -- ChipX Corp. today announced that the CX6200 family of structured ASIC products has passed the stringent USB Implementers Forum compliance test, and is placed on the USB-IF Integrators list. ChipX offers a complete struc ... read more |
| Freescale Delivers First Automotive Instrumentation Cluster MCU with On-Chip TFT Display Drive |
October 3, 2006 -- Freescale Semiconductor, Inc. has introduced a 16-bit microcontroller (MCU) designed for the next wave in automotive instrumentation clusters. The MC9S12XHZ512 MCU is the first instrumentation cluster MCU featuring an integrat ... read more |
| Nethra Licenses Tensilica's Diamond 108Mini Core Processor for Mobile Handset Imaging |
October 3, 2006 -- Tensilica, Inc. today announced that Nethra Imaging, a privately held developer of imaging solutions for consumer applications, has licensed the Diamond Standard 108Mini processor core as the main system controller for ... read more |
| Xilinx Announces First ESL for FPGA Workshop Featured |
October 2, 2006 -- Xilinx, Inc. today announced an ESL for FPGA workshop to be held in San Jose, Calif., on November 6, 2006. The event will provide an opportunity for the design community to experience first hand the value and immediate ... read more |
| UMC and IME to Partner on Advanced Noise Modeling for Nanometer Technologies |
October 2, 2006 -- UMC (United Microelectronics Corp.) and Singapore's Institute of Microelectronics (IME), have sealed a partnership to jointly develop radio frequency (RF) modeling solutions for 90-nm technologies. The cooperatio ... read more |
| Cadence Develops Lithography-Aware Design Flow in Collaboration with Brion and Clear Shape |
October 2, 2006 -- Cadence Design Systems, Inc. has created a lithography-aware design flow and has defined an interface that will link resolution enhancement technologies (RET) with physical design and verification. Cadence has collabor ... read more |
| EDA Consortium Reports 15% Revenue Growth in Second Quarter 2006 Featured |
October 2, 2006-- The EDA Consortium (EDAC)'s Market Statistics Service (MSS) today announced that EDA industry revenue for Q2 of 2006 grew 15% to $1,256 million, versus $1,091 million in Q2 2005, due in part to new company participation. ... read more |
| Agilent Technologies' Newest ENA Series RF Network Analyzer Raises the Bar for RF Network Analyzers |
October 2, 2006 -- Agilent Technologies, Inc. has announced the newest version of its ENA Series RF network analyzer. Featuring the highest performance, extended lower frequency range and fastest speed in its class, the Agilent ENA is the ... read more |
| Worldwide Semiconductor Sales Hit Record $20.5 Billion in August |
October 2, 2006 -- The Semiconductor Industry Association (SIA) reported today that worldwide sales of semiconductors reached an all-time monthly record of $20.5 billion in August, an increase of 10.5% from the $18.6 billion reported in A ... read more |
| TI Introduces First Digital Audio Amplifier Power Stage that Drives more than 300 Watts on a Single Channel |
October 2, 2006 -- Texas Instruments, Inc. (TI) has introduced two new PurePath Digital power stages. The TAS5261 provides OEMs with the industry's highest power single-chip digital amplifier power stage, capable of driving more than 300W ... read more |
| NEC Selects PMC-Sierra's Metro Transport Semiconductor Solutions for SpectralWave Series |
October 2, 2006 -- PMC-Sierra, Inc. today announced that NEC has selected PMC-Sierra's metro transport semiconductor solutions for incorporation into its SpectralWave series. PMC-Sierra's Chess III and Chess Wideband family of solutions l ... read more |
| Chipidea Introduces Portfolio of Programmable Sigma-Delta Data Converter Cores to Support Multiple Applications |
October 2, 2006 -- Chipidea Microelectronica, SA has introduced a wide-ranging portfolio of sigma-delta analog-to-digital converters (ADCs) that are programmable for either high-performance or low power consumption for a multitude of appl ... read more |
| Si2 Announces Sponsorship of 3D Architectures for Semiconductor Integration and Packaging Conference |
October 2, 2006 -- The Silicon Integration Initiative, Inc. (Si2) announced today its sponsorship of the 3D Architectures for Semiconductor Integration and Packaging Conference. This conference will be held October 31 through November 2, ... read more |
| Analog Devices' Low-Power Data Conversion Technology Enables New Dimensions in Portability and Performance for Medical and Industrial Electronics |
October 2, 2006 -- Analog Devices, Inc. (ADI) is lowering the power consumption of medical and industrial electronics with its latest precision PulSAR analog-to-digital converter (ADC). Designed to increase the portability of patient and ... read more |
| Cypress University Alliance Program Launches $160,000 Global Design Competition for Students Designing with Cypress Products |
October 2, 2006 -- Cypress Semiconductor Corp. today launched a $160,000 global design competition that lets students who design with Cypress technology compete regionally for Cypress innovation awards of up to $20,000 in cash and ultimat ... read more |
| Yogitech Introduces OCP Universal Verification Component |
October 2, 2006 -- Yogitech SPA has introduced the industry’s first mixed-language OCP Universal Verification Component (UVC). Supporting both e and SystemVerilog verification languages, the Yogitech OCP UVC is the only commercial verific ... read more |
| Displaytech Switches to Synopsys Design Compiler Tool for Next-Generation FLCOS Microdisplays |
October 2, 2006 -- Synopsys, Inc. today announced that Displaytech Inc., a leader in ferroelectric liquid-crystal-on-silicon (FLCOS) microdisplays, has moved to the Synopsys Design Compiler synthesis tool in designing its next-generation ... read more |
| VIA Technologies Launches HDTV-Ready Unified Chipset for Embedded Market |
September 29, 2006 -- VIA Technologies, Inc. today introduced the VIA CX700M digital media IGP chipset for the VIA C7 and Eden processor platforms. Designed specifically for the embedded market, the VIA CX700M integrates premium graphics, ... read more |
| PrismTech Provides Anritsu with OpenFusion Middleware for Next-Generation Telecommunications Systems |
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September 29, 2006 -- PrismTech Corp. has announced that it is supplying its OpenFusion e*ORB middleware solution to Anritsu Instruments Company, a subsidiary of Anritsu Corp., a provider of operational support and measurement solutions ... read more |
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