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 Category: News: News Archive 2006: Saturday, May 18, 2013
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NEC Electronics America Extends 16- and 32-Bit All Flash Microcontroller Lineup 

December 12, 2006 -- NEC Electronics America, Inc. has added sixteen new devices to its portfolio of 16- and 32-bit all flash microcontrollers (MCUs). These latest MCUs offer up to twice the memory and a significant increase in pin-count ... read more

Triad Semiconductor Forms Triad Alliance Program for ASIC Partners 

December 12, 2006 -- Triad Semiconductor, Inc. has launched the Triad Alliance Program. The Triad Alliance includes Authorized Design Centers, Design Centers Partners, Triad IP Providers, EDA Vendors and ASIC Companies. Triad Semiconducto ... read more

Hitachi and Renesas Electronics Develop Phase-Change Memory Cell Technology Enabling Low-Power Operation and Stable Fabrication 

December 12, 2006 -- Renesas Electronics Corp. and Hitachi, Ltd. have developed a new cell technology that will enable stable fabrication of phase-change memory while maintaining low-power operation performance. The newly developed ... read more

TI Introduces High-Power PoE Manager for Multi-Port Systems 

December 12, 2006 -- Texas Instruments, Inc. (TI) has introduced a fully integrated Power over Ethernet (PoE) management device that allows multi-port enterprise systems to deliver up to 25W over a standard Ethernet cable. Supporting oper ... read more

California Micro Devices Expands Family of DDR Linear Power Solutions for Digital Consumer Applications 

December 12, 2006 -- California Micro Devices Corp. has announced the CM3212 dual output linear regulator for powering DDR (Double Data Rate) memory in digital consumer and PC peripheral applications such as digital TVs, set top boxes, DV ... read more

Atmel's Latest ARM9-based Microcontroller Significantly Increases Internal Data Bandwidth 

December 11, 2006 -- Atmel Corp. has announced the newest member of its SAM9 family, the AT91SAM9263, embedding a 200-MIPS ARM926EJ-S-based microcontroller that overcomes the bottlenecks that occur with conventional ARM9-based MCUs in gra ... read more

ARM High-Speed PHY And High-Performance Standard Cells for 65-Nanometer Platform Adopted by Fujitsu 

December 11, 2006 -- ARM today announced that the ARM Velocity PHY for PCI-Express Gen-2 and the Advantage v2.0 standard cell library, part of its Artisan physical IP family, has been adopted by Fujitsu, Ltd. on Fujitsu's CS200 HP 65-nm p ... read more

Cradle's CT3400 to Enhance Security in New Apartment Buildings 

December 11, 2006 -- Cradle Technologies, Inc. today announce the release of the "i-Node H.264," a full-duplex video/audio TCP/IP intercom system based on Cradle's CT3400 MDSP. A single CT3400 IC provides all the necessary processing for ... read more

National Instruments Extends LabVIEW Embedded Design Platform to QNX Neutrino RTOS 

December 11, 2006 -- National Instruments Corp. and QNX Software Systems, Ltd. have teamed up to extend the LabVIEW graphical dataflow environment to the QNX Neutrino real-time operating system (RTOS). Engineers now can use the NI ... read more

CoWare Integrates Microsoft Windows Embedded CE on Virtual Platforms for Software Development 

December 11, 2006 -- CoWare, Inc. has announced the CoWare Virtual Platform product family is now interoperable with the Windows Embedded CE operating system. As a result, companies developing Windows Embedded CE-based electronics devices ... read more

Cypress Introduces Low-Power Programmable Radio-System-on-Chip Integrating 2.4-GHz Transceiver and Flash Microcontroller 

December 11, 2006 -- Cypress Semiconductor Corp. has introduced its next-generation Programmable Radio-System-on-a-Chip. The single-chip PRoC LP integrates the WirelessUSB LP 2.4-GHz transceiver with the low-cost enCoRe II 8-bit Flash mic ... read more

IPextreme to Bring Expanded Portfolio of Infineon IP to Automotive Electronics Market 

December 11, 2006 -- IPextreme Inc. has extended its partnership with Infineon Technologies AG to make another four automotive IP products available for license through IPextreme's IP Commercialization Program. IPextreme will marke ... read more

PDF Solutions and Fabbrix to Collaborate on Optimizing Manufacturability of IP Infrastructure Blocks at Sub-65nm 

December 11, 2006 -- PDF Solutions, Inc. has announced a plan to collaborate with Fabbrix, a venture backed company delivering design solutions for nanoscale technologies. The collaboration will address the yield challenges inheren ... read more

Stacked Memory Packaging Technology Takes Mobile Memory Design to New Level 

December 11, 2006 -- NEC Electronics, working jointly with Elpida Memory and Oki Electric, has developed packaging technology that will let cell phones and other portable devices be equipped with as much memory as a high-performance compu ... read more

Broadcom Delivers Single-Chip, 65-nm High Definition 1080p Digital TV Solution 

December 11, 2006 -- Broadcom Corp. today announced the first high definition (HD) digital TV silicon solution that supports full 1080p display resolution. Designed in 65-nm process geometry, this new "television-on-a-chip" enables TV and other ... read more

STARC Deploys Synopsys Design Compiler Topographical Technology in New 65nm Methodology 

December 11, 2006 -- Synopsys, Inc. today announced that the Semiconductor Technology Academic Research Center (STARC) has deployed Synopsys Design Compiler topographical technology in its 65-nm Synopsys Galaxy Design Platform-base ... read more

EM Microelectronic Announces Very Low-Power Crystal Oscillator IC 

December 11, 2006 -- EM Microelectronic, an electronic systems company of the Swatch Group, introduces the EM7604, a low-power CMOS crystal oscillator circuit. The EM7604 is intended to be used with a 32.768-kHz tuning fork crystal as a l ... read more

NEC Develops First 32nm-Node Multi-Layer Interconnect 

December 11, 2006 -- NEC Corp. and NEC Electronics Corp. today announced that they have successfully developed the first multi-layer interconnect for 32-nm-node ICs. The joint research verified the performance and reliability of the new ... read more

PMC-Sierra Announces 336-Channel T1/E1/DS3/E3 Framer 

December 11, 2006 -- PMC-Sierra, Inc. has announced the PM8310 TEMUX 336, a highly integrated and scalable framer solution for next generation voice, wireless and router platforms. The TEMUX 336 meets the demanding density and feature req ... read more

Tessera Introduces Thin Wafer-Level Chip-Size Packaging Technologies for Image Sensors and Other Optical Devices 

December 11, 2006 -- Tessera Technologies, Inc. has announced Shellcase RT, a thin, wafer-level chip size packaging (WLCSP) technology developed to provide key benefits to original equipment manufacturers (OEMs) and others developing adva ... read more




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