| High-speed Op Amps Built Using SiGe by Texas Instruments, Inc. (TI) in Electronic Engineering Times (EE Times) |
December 22, 2003 -- High-performance applications such as third-generation wireless basestations and measurement and medical equipment demand faster response times from high-speed, high-resolution data converters and the amplifiers used to driv ... read more |
| Achieving Signal Integrity for ASICs, PCBs and Packages by LSI Corp. in eeDesign (EE Times EDA News) |
December 19, 2003 -- High data-rate applications like Gigabit Ethernet, Infiniband, PCI Express, Fibre Channel and Serial ATA continue to drive system bandwidth to higher and higher levels, creating the need for high performance interconnect for ... read more |
| Modeling Is Key to Analog/RF Foundry Support by austriamicrosystems AG in Electronic Engineering Times (EE Times) |
December 18, 2003 -- Not every semiconductor company needs leading-edge technology. The analog/RF world has been quite happy with 0.35 micron and larger geometries for a number of applications. Analog does not scale like its digital counterpart, ... read more |
| Analog CMOS Supports Precision Specs by Texas Instruments, Inc. (TI) in Electronic Engineering Times (EE Times) |
December 18, 2003 -- Many new portable applications call for higher levels of integration and low power, along with highly integrated digital and analog electronics, requiring low-power electronics to extend battery life and reduce device size. ... read more |
| Harness Today's DSPs: Propel Tomorrow's Designs by in Electronic Design Magazine |
December 18, 2003 -- Designers always crave greater computational throughput in their DSP application s. More throughput equals richer DSP functionality, whether it's performing more exacting calculations to deliver better filtering or imaging o ... read more |
| Materials Make Signal Difference by in Electronic Engineering Times (EE Times) |
December 18, 2003 -- System-on-chip (SoC) design has traditionally catered to an obsession with fine-geometry CMOS. Each process node-the shift from 0.18 to 0.13 microns and then to 90 nanometers-has meant that more functionality could be incorp ... read more |
| CB Process Supports Consumer Amplifiers by National Semiconductor Corp. in Electronic Engineering Times (EE Times) |
December 18, 2003 -- Today the market for high-speed analog ICs is growing rapidly because of the ever-increasing demand for bandwidth. High-bandwidth amplifiers are finding such applications as xDSL and cable modems, set-top boxes, contact imag ... read more |
| How to Write DSP Device Drivers by Texas Instruments, Inc. (TI) in Embedded Systems Programming (embedded.com) |
December 15, 2003 -- Digital signal processors (DSPs) are now often integrated on-chip with numerous peripheral devices, such as serial ports, UARTs, PCI, or USB ports. As a result, developing device drivers for DSPs requires significantly mor ... read more |
| System Design and Process Technology Need Reconnecting by imec in Electronic Engineering Times (EE Times) |
December 15, 2003 -- During the last two decades, CMOS technologists have used scaling to deal with ever-increasing system complexity and performance requirements. Digital abstraction allowed process technology to evolve virtually independent ... read more |
| Nanometer IC Routing Requires New Approaches by Cadence Design Systems, Inc. in eeDesign (EE Times EDA News) |
December 12, 2003 -- In the nanometer era, the key to rapid time-to-market and profitability is fast, predictable design closure. And the key to efficient design closure is using a high performance, flexible routing engine that can achieve multi ... read more |
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