January 21, 2008 -- Advanced Micro Devices, Inc. (AMD) this week announced a significant number of platform-stable, energy-efficient additions to its embedded roadmap. The high-performance AMD Turion 64 X2 dual-core processors TL-56 and TL-62 can deliver the exceptional leading-edge 64-bit application performance and low power requested by designers in the industrial control, digital signage and point-of-sale embedded markets, while the energy-efficient AMD Sempron processor 3700+ offers additional performance in a consistent and low-power thermal envelope for value-based designs.

Also, the use of advanced AMD manufacturing process technology improvements allows for a new version of the Mobile AMD Sempron processor 2100+ that achieves up to a 15% reduction in thermal design power. All of these new products feature a consistent Socket S1, allowing for quicker development and delivery times through socket consistency and platform longevity.

Coupled with the new processors, a new chipset has also been added to the portfolio. Based on the AMD 690 Series chipsets, the AMD M690E provides additional display design flexibility for embedded graphics and enables seamless playback of high definition video content for embedded applications.

In addition to traction in commercial embedded markets such as storage and telecommunications, and strong partnerships with embedded infrastructure partners such as Aaeon, Axxtend, Fujitsu Siemens Computers, iEi, Kontron, and PDSi, there is currently strong demand for AMD technology in the digital signage, casino gaming and point-of-sale system markets.

In support of these markets, AMD is offering a COM Express form-factor reference-design kit which lets OEMs quickly design embedded systems that deliver high quality graphics, high performance, and high I/O throughput.

Availability