| Video Encoding with Low-Cost FPGAs for Multi-Channel H.264 Surveillance by Altera Corp. in Video/Imaging DesignLine |
November 28,2008 -- Low-cost FPGAs are now making it possible to implement high- performance encoding systems on a cost-effective and low-power FPGA fabric. This enables systems with the right combination of power, performance, and price-points ... read more |
| Power SOCs: A "Crazy" Idea That Just Might Work by EDN Magazine |
November 27, 2008 -- Imagine a cell-phone battery that could supply unlimited power and still fit into its current form factor: the perfect solution to the biggest drawback in today’s portable electronics, right? Wrong. Even with this magic batt ... read more |
| Get Hardware Fast: Use Your Evaluation Kit to Build a Testbench by Cypress Semiconductor Corp. in EDN Magazine |
November 27, 2008 -- Testing the firmware for your microcontroller project without hardware is about as satisfying as looking at photos of food when you are hungry. But the lack of "real" hardware does not have to delay hardware-based testing of ... read more |
| RFID in Embedded Designs: Your Move by EDN Magazine |
November 27, 2008 -- technology has the potential to become a common and important element in embedded-system design. In addition to the traditional role of the technology in inventory management, recent advances in RFID tags and high-speed, lon ... read more |
| Tips for Designing Ultra-Low Power Systems by Texas Instruments, Inc. (TI) in EDN Magazine |
November 25, 2008 -- Designing systems for low power operation is becoming more and more common. Some of the drivers for this trend include: consumer demand and/or product requirements for longer times between battery charges or swapping out bat ... read more |
| Unified Verification for Hardware and Embedded Software Developers by Emulation and Verification Engineering (EVE) in EE Times EDA Designline |
November 25, 2008 -- Moore's Law continues to drive chip complexity and performance to new highs, while stressing and periodically "breaking" existing design flows. Fortunately for consumers of electronic design automation (EDA) tools, the same ... read more |
| Packaging Goes Vertical by Electronic Engineering Times (EE Times) |
November 24, 2008 -- 3D semiconductor packages enable the form and function for many devices we use in our daily lives--mobile handsets, personal entertainment devices and flash drives, to name a few. For people who rely on such implantable medi ... read more |
| Solving FPGA I/O Pin Assignment Challenges by Xilinx, Inc. in EE Times Programmable Logic Designline |
November 19, 2008 -- Input/Output (I/O) pin assignment is one of the main challenges facing designers integrating large FPGA devices onto PCBs. Many designers find the process of defining the I/O pin configuration, or "pinout," of large FPGA dev ... read more |
| 3-D Integration Lacking in Design and Test Support by Semiconductor International |
November 18, 2008 -- Through-silicon vias (TSVs) have become a requisite, because 3-D circuit integration helps alleviate interconnect delay and density problems, while reducing chip area. In 2007, the Semiconductor Industry Association (SIA) wa ... read more |
| Planning, Adopting and Implementing Adaptive Reuse by Integrated Device Technology, Inc. (IDT) in EE Times EDA Designline |
November 18, 2008 -- It has been mentioned that during the rough-and-tumble days of 1950s Chicago politics, a ward boss asked an Adlai Stevenson volunteer who sent him to help in the campaign and when the response was nobody, he quickly replied: ... read more |
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