| eSilicon Enables Digi International to Introduce Flexible Ethernet Networking Module |
June 9, 2009 -- eSilicon Corp. today announced that it has successfully delivered right-first-time silicon, on-time and within budget to Digi International.
The eSilicon-produced ASIC (NS9215) is part of Digi International's Connec ... read more |
| ZeroG Wireless-Based Development Tools Enable Embedded Wi-Fi in PIC Microcontroller Designs |
June 9, 2009 -- Microchip Technology, Inc. has announced the ZeroG Wireless ZG2100M and ZG2101M Wi-Fi Modules, ZeroG IEEE 802.11 Development Kit for Explorer 16 and the ZeroG Wi-Fi PICtail/ PICtail Plus Daughter Board. Microchip and Ze ... read more |
| Integrand's EMX Uses TSMC's New iRCX Format to Increase Modeling Accuracy |
June 9, 2009 -- Integrand Software, Inc. has made enhancements to its EMX tool to support TSMC's iRCX, the new interoperable interconnect modeling format. Integrand and TSMC have done extensive research using EMX with iRCX at the 65-nm an ... read more |
| Microchip Technology Unveils Inductive Touch Sensing Analog Front End |
June 9, 2009 -- Microchip Technology, Inc. today announced the MCP2036 Analog Front End (AFE) for inductive touch-sensing applications. Complementing the company’s royalty-free mTouch inductive touch-sensing solutions, the fully-integrate ... read more |
| Microchip Announces Certified ZigBee PRO Stack and Longer-Range IEEE 802.15.4 Wireless Module |
June 9, 2009 -- Microchip Technology, Inc. has announced two additions to its IEEE 802.15.4 and ZigBee portfolio for short-range, low-data-rate embedded wireless networking. The MRF24J40MB is Microchip’s second 2.4-GHz RF, surface-mountab ... read more |
| Arasan Expands Analog Capability Through Acquisition |
June 9, 2009 -- Arasan Chip Systems, Inc. has expanded its Total IP Solutions capability with the acquisition of AFTEK’s Bangalore-based analog division.
AFTEK’s Bangalore analog division has a track record of multiple SOC tapeouts ... read more |
| Algotronix Provides AES Encryption Over USB with New Reference Designs |
June 9, 2009 -- Algotronix, Ltd. has announced the availability of a reference design that provides Advanced Encryption Standard (AES) over USB.
The company provides an interface to Altera's NIOS II soft processor that works with i ... read more |
| Agilent Announces New TriQuint Process Design Kit Streamlining MMIC Design |
June 9, 2009 -- Agilent Technologies, Inc. has announced the availability of a foundry-certified process design kit (PDK) to support TriQuint Semiconductor’s TQPED GaSs E/D pHEMT process. Providing the most complete MMIC design flo ... read more |
| New Cypress PSoC Devices Enhance Design Flexibility with Superior Analog and Digital Performance |
June 9, 2009 -- Cypress Semiconductor Corp. has introduced two new PSoC programmable system-on-chips with enhanced analog and digital performance. The CY8C21x45 and CY8C22xxx PSoC devices give engineers more design flexibility through gre ... read more |
| Microsemi Acquires Nexsem |
June 9, 2009 -- Microsemi Corp. has executed an asset purchase agreement with Nexsem, Inc., a small privately-held semiconductor designer and marketer of high-voltage DC-to-DC conversion devices targeted at fast-growing commercial ... read more |
| Advanced Architectures Chooses ChipStart as North America and EMEA Distribution Partner |
June 9, 2009 -- ChipStart, a deliverer of intellectual property (IP) solutions, has been selected by Advanced Architectures, an SOC design services and semiconductor intellectual property provider, as its U.S. and EMEA distributo ... read more |
| EMA Integrates Newark's Online Electronic Components Database with Cadence OrCAD Capture CIS |
June 9, 2009 -- EMA Design Automation has announced the availability of version 3.0 of the EMA Component Information Portal (CIP), providing access to the Newark electronic parts database through Cadence OrCAD Capture CIS. Newark is a lea ... read more |
| Synopsys Enables System Design Interoperability with System-Level Catalyst Program |
June 8, 2009 -- Synopsys, Inc. today announced its System-Level Catalyst Program to accelerate the adoption of system-level design and verification. Open to electronic design automation (EDA) vendors, intellectual property (IP) vendors, e ... read more |
| PLX Technology Selects Snowbush IP PCI Express 3.0 PHY for Next-Generation Switches |
June 8, 2009 -- Gennum Corp. today announced that Inc. chose its Snowbush IP Group's PCIe 3.0 PHY for the PLX next generation of PCIe switches. The availability of the PHY from Snowbush IP gives PLX the capability to accelerate support fo ... read more |
| Gennum's Snowbush IP Group Delivers the First PCI Expess 3.0 PHY IP on TSMC 40-nm Process |
June 8, 2009 -- Gennum Corp. today announced that its Snowbush IP group has developed the first available integrated PCI Express 3.0 (Gen 3) PHY and Controller IP solution.
The new Snowbush PCIe 3.0 IP is architected for low power ... read more |
| MoSys Acquires Prism Circuits |
June 8, 2009 -- MoSys, Inc. today announced the acquisition of substantially all of the assets and business of privately held Prism Circuits, Inc., a supplier of high data rate parallel and serial interface (I/O) IP.
The acquisition ... read more |
| Cadence Unveils Integrated Chip Planning and Implementation Solution to Improve Predictability and Reduce Risk of IC Designs |
June 8, 2009 -- Cadence Design Systems, Inc. has unveiled a solution that provides design and implementation engineers with superior visibility and predictability of chip performance, area, power consumption, cost, and time-to-market acro ... read more |
| Casio Selects Cadence C-to-Silicon Compiler for High-Level Synthesis |
June 8, 2009 -- Cadence Design Systems, Inc. today announced that Casio Computer Co., Ltd. has selected the Cadence C-to-Silicon Compiler as its high-level synthesis solution. After a series of comprehensive benchmarks, Casio selected the ... read more |
| Lattice Announces New Automotive-Qualified Chip-Scale 132 BGA Packaging for the LatticeXP2 Family |
June 8, 2009 -- Lattice Semiconductor Corp.is making available automotive-temperature-qualified (AEC-Q100) low-cost chip-scale 132 BGA (ball grid array) packaging for the non-volatile LatticeXP2 FPGA family. Based on Lattice's 90-nm hybri ... read more |
| Cypress’s PSoC and CyFi Enable Smart Connectivity for Remote Controls in PURE’s Audio Systems |
June 5, 2009 -- PURE, the UK’s leading radio manufacturer, has employed Cypress Semiconductor Corp.’s CyFi low-power wireless solution powered by a PSoC programmable system-on-chip to implement communication in the remote control for the ... read more |
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