| MontaVista Software Announces Support for RMI's Superscalar Multi-Core XLP Processor Family |
May 21, 2009 -- MontaVista Software, Inc. has announced its plans to support RMI’s Raza Microelectronics, Inc.'s newest generation multi-core processor family, the XLP Processor.
The superscalar XLP Processor family drives ... read more |
| TI Introduces Octal-Channel, Low-Power DAC Family with Internal Reference |
May 21, 2009 -- Extending its family of 12-, 14-, and 16-bit digital-to-analog converters (DACs), Texas Instruments, Inc. (TI) has introduced the DAC8568 (16-bit), DAC8168 (14-bit) and DAC7568 (12-bit) for data acquisition systems, indust ... read more |
| National Instruments Introduces Digital Hardware with Xilinx FPGA Technology for Hands-On Learning |
May 21, 2009 -- National Instruments Corp. has introduced a digital learning device that gives high school, university and vocational students hands-on experience with digital logic and field-programmable gate array (FPGA) technology. The ... read more |
| Virage Logic Introduces Multi-Time Programmable Non-Volatile Memory Solution at 65-nm |
May 21, 2009 -- Virage Logic Corp. has qualified its AEON non-volatile memory (NVM) solution on TSMC's 65-nm Low Power (LP) process, and is the first multi-time programmable (MTP) logic NVM solution commercially available on a 65-nm proce ... read more |
| eMemory Announces Availability of Low-Cost NeoROM OTP Mass Production Solution |
May 21, 2009 -- eMemory Technology, Inc. has announced the roll-out of NeoROM, a one-time programmable (OTP) solution for products in mass production. The solution lets users select an appropriate mass production approach based on a produ ... read more |
| Crossware Enhances 8051 Suite with Support for Silicon Labs’ C8051f7xx Microcontrollers |
May 21, 2009 -- Crossware Products has enhanced its 8051 Development Suite by adding support for Silicon Laboratories’ recently introduced C8051F7xx family of high pin-count, touch-sensing microcontrollers.
The Silicon Labs’ C8051F ... read more |
| Cadence Speeds Systems Development with Automated Transaction-Level Verification |
May 21, 2009 -- Cadence Design Systems, Inc. has delivered an extended system-level verification solution that supports the Open SystemC Initiative (OSCI) TLM 2.0 standard. This new solution natively recognizes TLM 2.0 constructs to autom ... read more |
| Cadence Introduces FPGA-PCB Co-Design Solution |
May 20, 2009 -- Cadence Design Systems, Inc. has introduced a scalable co-design solution for designing FPGAs onto PCB systems. The Cadence OrCAD and Allegro FPGA System Planner shortens time to design-in complex FPGAs with large pin coun ... read more |
| Berkeley Design Automation's Analog FastSpice Platform Adopted by Panasonic |
May 21, 2009 -- Panasonic Corp. has selected Berkeley Design Automation, Inc.'s Analog FastSpice platform for use in its production flow for verification of mixed-signal integrated circuits.
"We spend a significant amount of effort ... read more |
| Atmel and ARM Expand Strategic Relationship with Subscription License Agreement |
May 21, 2009 -- Atmel Corp. and ARM have announced an extension to their strategic relationship with a new subscription license agreement. Under the terms of the agreement, Atmel gains access to a number of existing and future ARM ... read more |
| ARM Selects Jasper for Formal Verification of IP |
May 21, 2009 -- Jasper Design Automation today announced its JasperGold Verification System has been adopted by ARM for the design and verification of increasingly sophisticated IP, with a view to increased assurance levels, reduced verif ... read more |
| 3L Joins Texas Instruments Developer Network to Provide Multiprocessor Design Solution |
May 21, 2009 -- 3L, Ltd. has joined the Texas Instruments, Inc. (TI) Developer Network as a provider of multiprocessor design solutions. The amove strengthens 3L’s multiprocessor design flow targeting TI digital signal processors (DSPs) ... read more |
| Tektronix Delivers Accurate Superspeed USB Test Solution |
May 21, 2009 -- Tektronix, Inc. has announced a new comprehensive toolset for characterization, debug and automated compliance test of Superspeed USB (USB 3.0) devices. The new option USB-TX with the DPO/DSA70000B oscilloscope provides an ... read more |
| Open-Silicon Executes Product Development in Record Time |
May 20, 2009 -- Open-Silicon, Inc. has announced successful completion of the software development phase of a custom ASIC device developed for NXP Semiconductors. Open-Silicon took the design from specification through production, includi ... read more |
| MIPS64 Architecture Powers New Superscalar XLP Processor from RMI |
May 20, 2009 -- MIPS Technologies, Inc. today announced that its high-performance MIPS64 architecture is powering the new XLP Processor from RMI Corp. The XLP Processor is reportedly the highest performance per watt multi-core pro ... read more |
| Magma's FineSim Spice Certified for TSMC Spice Tool Qualification Program |
May 20, 2009 -- Magma Design Automation, Inc.'s FineSim Spice has been certified to meet the accuracy, performance and process compatibility requirements of the TSMC Spice Tool Qualification Program. Designers can now use FineSim Spice wi ... read more |
| NEC Electronics Introduces USB 3.0 Host Controller |
May 20, 2009 -- NEC Electronics has introduced the first Universal Serial Bus (USB) host controller for the new SuperSpeed USB 3.0 standard. The µPD720200 device is a host controller for PCs and other digital devices, and is based on the ... read more |
| Microchip Technology Unveils Operational Amplifiers with On-Chip, One-Shot Calibration Circuits |
May 20, 2009 -- Microchip Technology, Inc. has announced the first op amps to include mCal, an on-chip calibration circuit that calibrates offset voltage at power-up using an internal power on-reset detector, or based upon the state of an ... read more |
| Silicon Frontline Technology Announces Post-Layout EDA Verification Software |
May 20, 2009 -- Silicon Frontline Technology, Inc. (SFT), a new company founded by electronic design automation (EDA) technologists, has announced its first products for post-layout verification: F3D (Fast 3D) for fast 3D extraction and R ... read more |
| Innovision and NXP Announce Joint NFC Marketing and Licensing Agreement |
May 20, 2009 -- Innovision Research and Technology plc and NXP Semiconductors have entered into a joint marketing and licensing agreement related to the Near Field Communication technology.
The agreement brings together advan ... read more |
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