| XMOS USB Audio 2.0 Reference Design Provides Highest Quality Audio Solution |
November 16, 2009 -- XMOS Semiconductor, Ltd. has announced the a reference design for USB Audio 2.0. Implemented entirely in software, using the XMOS XS1-L1 event-driven processor, the design supports hi-speed USB Audio 2.0 connectivity ... read more |
| FPGAs Speed Financial Derivative Risk Analysis By More than 1100X |
November 16, 2009 -- Pico Computing and ET International today announced that an FPGA cluster has been used to provide near-real-time Value-at-Risk (VaR) and options pricing analysis, representing a greater than 1100X overall application ... read more |
| Dolphin Integration Complements 130-nm Offerings with a Low-Voltage Release of the Cassiopeia ROM |
November 13, 2009 -- Dolphin Integration's Cassiopeia architecture for single-via has been enhanced with a capability to operate from nominal voltage down to 1.1V, ±10%, in the TSMC 130-nm LP process.
Cassiopeia is an architecture f ... read more |
| Lionic Selects PLDA IP for New Generation ePavis II Security Solution |
November 16, 2009 -- PLDA announced that Lionic Corp. will launch its ePavis II PCI Express-based solution, incorporating PLDA’s XpressRich2 PCI Express ASIC IP. Lionic, a provider of high-performance connectivity solutions for con ... read more |
| Avnet, TI and Xilinx Launch Analog eLab Videocast Series |
November 13, 2009 -- The Avnet Electronics Marketing, Texas Instruments (TI) and Xilinx, Inc. have launched a new multipart videocast series emphasizing TI’s Fusion Digital Power solutions for the latest generation of Xilinx field-program ... read more |
| Actel Strengthens Fusion Mixed-Signal FPGA IP Offering for xTCA Platform Management Applications |
November 16, 2009 -- Actel Corp. today announced IP core enhancements for hardware platform management applications. Developed in close collaboration with Pigeon Point Systems, an Actel company, the new and improved cores further s ... read more |
| Phasor Solutions Selects TowerJazz for Transceiver Chipset for Mobile Broadband Service |
November 13, 2009 -- TowerJazz and Phasor Solutions, a developer of high-performance phased array antennas for satellite communications and radar applications, today announced that Phasor has selected TowerJazz’s high-performance SiGe BiC ... read more |
| Cadence Announces Expanded SOC Design Alliance with Toshiba |
November 16, 2009 -- Cadence Design Systems, Inc. has extended and expanded the scope of its recently announced relationship with Toshiba Corp. for COT (customer-owned tooling) and SOC design targeting the growing mobile and consumer mark ... read more |
| Lattice Announces Production Release of Highest Density LatticeECP3 FPGA |
November 16, 2009 -- Lattice Semiconductor Corp. today announced that the LatticeECP3-150 FPGA, the highest-density device in its low-power ECP3 mid-range FPGA family, has been fully qualified and released to volume production.
The ... read more |
| Silicon Storage Technology to Be Acquired |
November 13, 2009 -- Silicon Storage Technology, Inc. (SST) has entered into a definitive merger agreement to be acquired by Technology Resource Holdings, Inc., a Prophet Equity LP-controlled entity, as well as by members of SST's manage ... read more |
| Altera Delivers Serial RapidIO 2.1 IP Solution |
November 16, 2009 -- Altera Corp. today announced the immediate availability of the first intellectual property (IP) core supporting the RapidIO 2.1 specification. Altera's Serial RapidIO IP core supports up to four lanes at 5.0GBaud per ... read more |
| Stretch Secures $10M in Mezzanine Funding Round |
November 12, 2009 -- Stretch, Inc. today announced it has received $10 million in mezzanine funding, co-led by existing investors Worldview Technology Partners, Oak Investment Partners, and Menlo Ventures.
"This last round of fundin ... read more |
| Si2 Announces Sponsorship of "3D Architectures for Semiconductor Integration and Packaging Conference" |
November 10, 2009 -- The Silicon Integration Initiative, Inc. (Si2) announced today its sponsorship of the "3-D Architectures for Semiconductor Integration and Packaging Conference." This conference will be held December 9-11, 2009, at th ... read more |
| Technical Presentations from North American SystemC Users Group Meeting Now Online |
November 10, 2009 -- The Open SystemC Initiative (OSCI) announced that videos of the technical presentations from the 11th North American SystemC Users Group (NASCUG 11) are now available free-of-charge to the worldwide electronic design ... read more |
| Posedge Annouces High-Performance 10-Gbps IEEE 802.1AE (MACsec) IP Core |
November 12, 2009 -- Posedge, Inc. has announced the availability of its L2SEC Soft IP Core that performs full-duplex 10-Gbps MAC layer Security fully conforming to IEEE 802.1AE standard. Posedge has developed the L2SEC engine leveraging ... read more |
| STMicroelectronics and NXP Announce Agreement for Licensing of Contactless MIFARE Technology |
November 12, 2009 -- NXP Semiconductors and STMicroelectronics today announced a global strategic licensing agreement for NXP's MIFARE technology. The licensing agreement now enables STMicroelectronics to integrate the entire MIFAR ... read more |
| Imagination Technologies and Green Plug Partner to Develop and Promote Energy Management Technology |
November 12, 2009 -- Imagination Technologies, Ltd. and Green Plug, Inc., a developer of digital technology enabling smart communication between electronic devices and their power sources, have entered into an agreement that will enable G ... read more |
| Arphic Technology Joins MIPS Alliance Program |
November 12, 2009 -- MIPS Technologies, Inc. announced that Arphic Technology Co., Ltd. has joined the MIPS Alliance Program to provide professional font support for a variety of digital devices, including cell phones, netbooks, e-book re ... read more |
| Mentor Graphics to Join the SOI Industry Consortium |
November 12, 2009 -- The SOI Industry Consortium announced today that Mentor Graphics Corp. has joined the organization. As an active member, Mentor will expand EDA tool and methodology support for SOI technology. This engagement c ... read more |
| Zuken's CADSTAR Gets a Makeover in Version 12.0 |
November 10, 2009 -- The latest version of CADSTAR from Zuken, Ltd. features a makeover for ease of use, along with new technology for design reuse and managing obsolescence. For migrating users, version 12.0 also helps to protect and ret ... read more |
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