May 24, 2010 -- Agilent Technologies, Inc. has announced Electromagnetic Professional (EMPro) 2010, a new release of its 3D electromagnetic (EM) modeling and simulation software for analyzing the 3D EM effects of IC packages, connectors, antennas and other RF components. Used in the development of high-frequency and high-speed electronic devices, the new release features significant improvements in simulation speed and design efficiency.
Some of the new capabilities now available in EMPro 2010 include:
Faster finite element method (FEM) simulations through meshing improvements and use of symmetry planes.
Built-in acceleration of finite difference time domain (FDTD) simulations utilizing graphics processor unit (GPU) hardware.
Enhanced FEM accuracy through the use of new sheet ports and material property models.
Improved design efficiency with a new bondwire component, ODB++ file support for printed-circuit-board designs, and several other new user interface features/
Microsoft Windows 7 support in addition to Microsoft Windows XP, Vista and Linux support.