| Virtual Versus Physical Prototyping: Get It Right Faster by Mentor Graphics Corp. in EE Times EDA Designline |
November 28, 2011 -- In the Aberdeen Group survey report, "Why PCB Design Matters to the Executive," best-in-class electronics companies pointed at virtual prototyping as one of the best strategies to improve their PCB design best practices and ... read more |
| Validating Embedded Flash Memory Products to Endure Power Faults by EE Times Memory Designline |
November 25, 2011 -- Validating embedded Flash memory products for power-fault resilience establishes their ability to reliably endure the power faults that embedded system designs inevitably encounter during their normal operation. Fortunately, ... read more |
| Prototyping Mesh-of-Tree NOC-Based MPSOC on Mesh-of-Tree FPGA Devices by Design & Reuse |
November 23, 2011 Multi-processor system-on-chip (MPSoC) is a growing industry; studies predict the use of hundreds of processors in one system. However, the impact of targeted device internal structure on the implementation of such systems has ... read more |
| Using FPGAs to Solve Challenges in Industrial Applications by Xilinx, Inc. in EE Times Programmable Logic Designline |
November 22, 2011 -- The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity, lower total cost of ownership, and high safety. As a result, industrial applications drive an insati ... read more |
| System Performance Analysis and Software Optimization Using a TLM Virtual Platform by Mentor Graphics Corp. in EE Times EDA Designline |
November 22, 2011 -- A global leader in aerospace electronics needed to quantify the performance of their customers' embedded code running on one of their delivered systems. They were able to successfully accomplish this goal by using a TLM 2.0 ... read more |
| Medical Sensors in Biomedical Electronics: The Brain, Heart and Lung by EDN Magazine |
November 22, 2011 -- Biomedical electronics research is being driven by the aging "baby-boomer" population and their medical needs. This phenomenon is spurring fast development of new biotechnologies and need for access to innovative means of me ... read more |
| Qualitative to Quantitative Sensor Transition Challenges by EDN Magazine |
November 22, 2011 -- Consider an OEM's plan to use a 3-axis accelerometer to measure the angular acceleration of a laptop. The concept is to use this information to determine if the laptop is falling, sliding or tipping off a table, prior to ent ... read more |
| Building 3D-ICs: Tool Flow and Design Software - Part 2 by Tezzaron Semiconductor in EE Times EDA Designline |
November 21, 2011 -- This article discusses the current state of 3D tools and software, describes a working flow, and identifies the areas where more progress is needed. We base the discussion on a specific next-generation demonstration device ... read more |
| A Brief Primer on Embedded SOC Packaging Options by Freescale Semiconductor, Inc. in EE Times Embedded |
November 20, 2011 -- With shrinking technology, voltage levels are being reduced, lowering noise margins required to enable a clean design from a signal integrity perspective. Higher operating frequency requirements further complicate design clo ... read more |
| The Future of Computers - Part 1: Multicore and the Memory Wall by EDN Magazine |
November 17, 2011 -- In this first of three features, processor expert Russell Fish provides his take on the future of computers, and multicore processing in particular. Contentious and opinionated, Fish pulls no punches but provides a good intr ... read more |
|
