| Designing High-Power, High-Frequency Magnetics by Electronic Design Magazine |
September 26, 2011 -- The demands on switch-mode power supply power transformers and inductors are increasing rapidly. High-frequency power electronic equipment is being designed for power levels that are moving into the medium to high kilowatt ... read more |
| Problems and Pitfalls with Signal Integrity at 10Gbps and Beyond by Vitesse Semiconductor Corp. in EE Times Planet Analog |
September 23, 2011 -- Experienced designers of 10-Gbps (10G) Ethernet, SONET/OTN, Infiniband (QDR/FDR), and Fibre channel (16/ 8GFC) products are well aware that the maintenance of signal quality is far more difficult at 10-Gbps speeds than in t ... read more |
| Un-Rolling with the Times by Mentor Graphics Corp. in Electronic Engineering Journal |
September 22, 2011 -- For quite some time now, embedded software developers compared to their hardware brethren, have had the option of "rolling their own" or building their own toolchain. As strange, and as risky, as that may sound to hardware ... read more |
| Integrated MCUs Simplify Hybrid, EV Motor Control by Fujitsu Microelectronics Europe GmbH in EE Times Automotive Designline |
September 22, 2011 -- All-electric vehicles that function without an internal combustion engine need safe, cost-effective, and high-capacity energy-storage systems. Efficient software algorithms, powerful microcontrollers and highly efficient el ... read more |
| Latches and Timing Closure: A Mixed Bag by Freescale Semiconductor, Inc. in EDN Magazine |
September 22, 2011 -- Digital blocks contain combinational and sequential circuits. Sequential circuits are the storage cells with outputs that reflect the past sequence of their input values, whereas the output of the combinational circuits dep ... read more |
| Partial Reconfiguration in FPGA Rapid Prototyping Tools by Design & Reuse |
September 22, 2011 -- FPGA rapid prototyping tools are greatly useful at the time of designing and testing complex signal processing systems, due to their graphic programming environment and the possibility they offer to functionally simulate th ... read more |
| How to Test 3D Chips by Electronics Weekly |
September 21, 2011 -- Semiconductor design is starting to see the adoption of 3D IC packages. These packages involve stacking multiple bare die vertically using connections that go directly though the silicon. Through-silicon vias (TSV) result i ... read more |
| Basics of LRDIMM by Inphi Corp. in EDN Magazine |
September 20, 2011 -- At the heart of the LRDIMM (load-reduced dual inline memory module) technology is the memory buffer. The memory buffer re-drives all of the data, command, address and clock signals from the host memory controller and provid ... read more |
| A New Approach to Hardware Design Project Management by Methodics LLC in EE Times EDA Designline |
September 20, 2011 -- Data management has always been a pesky ‘background' problem for IC designers, who usually found ways to stitch together reasonably effective solutions. In the beginning there were files and directories, and developers woul ... read more |
| In-Target Embedded Software Test Automation and Quality by Atollic AB in EE Times MCU Designline |
September 19, 2011 -- Releasing a product with bugs is potentially very expensive, especially considering the cost of field upgrades, recalls and repairs. Less quantifiable, but at least equally important, is the damage done to reputation and co ... read more |
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