October 13, 2011 -- SMSC announced today that Samsung Electronics Co., Ltd. has licensed SMSC's patented Inter-Chip Connectivity (ICC) technology. ICC enables the USB 2.0 protocol to be delivered over short distances consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining 100% software compatibility with an analog USB 2.0 connection.
The High-Speed Interconnect (HSIC) specification (an addendum to the USB 2.0 specification) incorporates ICC technology. Where applicable, such as in portable applications, the ICC technology dramatically decreases power consumption and silicon area compared to an analog USB 2.0 interface.
Using its ICC license with SMSC, Samsung can develop devices that are designed to be compliant with the HSIC specification for both USB 2.0 host and USB 2.0 device applications.
About SMSC's ICC technology
SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC's ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC's ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC.
Go to the SMSC website to find additional information.
