| Evatronix Facilitates Chip-to-Chip Connectivity with Its High Speed Inter-Chip (HSIC) PHY IP |
February 15, 2011 -- Evatronix SA has introduced a High-Speed Inter-Chip (HSIC)-compatible PHY IP for significant power and area savings in USB 2.0 chip-to-chip connections.
Implementation of the HSIC technology enables ... read more |
| Huawei Extends License with SPIRIT DSP for HD Voice and Video |
February 16, 2011 -- SPIRIT DSP announced today that Huawei Technologies has extended its license with SPIRIT DSP for HD voice and video to carriers.
Under terms of the agreement, Huawei, an existing SPIRIT custome ... read more |
| Qualcomm Licenses SMSC's Inter-Chip Connectivity Technology |
February 15, 2011 -- SMSC announced today that Qualcomm, Inc. has licensed SMSC's patented Inter-Chip Connectivity (ICC) technology. ICC enables the USB 2.0 protocol to be delivered over short distances consuming a fraction of the ... read more |
| TenAsys Enhances Real-Time Software for 64-Bit Windows |
February 16, 2010 -- TenAsys Corp. has announced that its flagship products INtime for Windows real-time operating system (RTOS) and eVM for software have been upgraded to support 64-bit Windows.
64-bit Windows allows m ... read more |
| Viber Media Turns to SPIRIT for Quality HD Mobile VoIP Calling |
February 15, 2011 -- SPIRIT DSP announced today that its TeamSpirit Voice Engine Mobile is powering the new Viber Media application that offers free HD Voice over IP (VoIP) calls from the iPhone.
"Within three days of ... read more |
| Actions Semiconductor Adopts S2C's Fourth-Generation Rapid SOC/ ASIC Prototyping System |
February 16, 2011 -- S2C, Inc. announced today that Actions Semiconductor Co., Ltd., a leading fabless design company that provides mixed-signal and multimedia SOC solutions for portable consumer electronics, purchased S2C's fourth ... read more |
| Agilent Technologies' Latest 3-D EM Simulation Platform Provides Faster, More-Accurate Modeling of RF, High-Speed Components |
February 16, 2011 -- Agilent Technologies, Inc. today announced Electromagnetic Professional 2011.02, a new release of its 3-D electromagnetic modeling and simulation platform for creating 3-D models and analyzing the electrical performan ... read more |
| ARM Development Studio-5 v5.4 Delivers Enhanced ARM NEON Technology Support |
February 16, 2011 -- ARM has announced the release of the Development Studio 5 (DS-5) v5.4, which delivers enhancements to its compiler, debugger and performance analysis tools. DS-5 v5.4 brings improved support for the ARM NEON multimedi ... read more |
| Lorentz Solution's PeakView EM Design Platform Utilized by Altera to Address High Speed Design Challenges |
February 16, 2011 -- Lorentz Solution, Inc. today announced that Altera Corp. has added PeakView CMP capability to its existing PeakView EM Design Platform solution. With PeakView CMP capability added to the device-modeling flow, p ... read more |
| STMicroelectronics Teams with LifeNexus to Produce the iChip Microprocessor for the Personal Health Card |
February 16, 2011 -- STMicroelectronics and LifeNexus, Inc., the developer of the iChip and Personal Health Card, today announced that STMicroelectronics will produce the iChip microprocessor for the LifeNexus Personal Health Card. ... read more |
| Achronix and Mentor Graphics Provide State-of-the-Art Physical Synthesis Support for Speedster22i FPGAs |
February 15, 2011 -- Achronix Semiconductor Corp. today announced a formal agreement with Mentor Graphics Corp. to provide advanced synthesis support for Achronix Semiconductor's Speedster22i field programmable gate arrays (FPGAs). ... read more |
| STATS ChipPAC Launches Enhanced Flip-Chip Packaging with fcCuBE Technology |
February 15, 2011 -- STATS ChipPAC, Ltd. has launched the fcCuBE technology, an advanced flip-chip packaging technology that features copper (Cu) column bumps, Bond-on-Lead (BoL) interconnection and enhanced assembly processes. ... read more |
| Si2's Low Power Coalition Releases Common Power Format Standard Version 2.0 |
February 15, 2011 -- The Silicon Integration Initiative, Inc. (Si2) today announced release of the Common Power Format (CPF) Version 2.0, incorporating major enhancements to the widely adopted low-power intent format. CPF 2.0 was approved ... read more |
| IAR Systems Launches Complete Development Kit For Freescale Kinetis K60 Family of MCUs and Modular Tower System |
February 14, 2011 -- IAR Systems AB has announced availability of a new IAR KickStart Kit for Freescale Semiconductor, Inc.’s ARM Cortex-M4 based Kinetis family of microcontrollers that is compatible with the Freescale Tower System ... read more |
| Intersil Introduces New High-Speed ADC Family Offering Best-in-Class Performance and Power |
February 15, 2011 -- Intersil Corp. today announced its newest family of analog-to-digital converters (ADCs). Simplifying system design and speeding time-to-market, the new family offers pin-compatible 12-, 14- and 16-bit ADCs with sample ... read more |
| MediaTek Adopts Mentor Graphics Calibre PERC as Its ESD and Circuit-Reliability Verification Solution |
February 14, 2010 -- Mentor Graphics Corp. today announced that MediaTek, Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, has adopted the Calibre PERC product as its solut ... read more |
| CEVA Collaborates with NEC CASIO Mobile Communications for Future Wireless Baseband Technologies |
February 14, 2011 -- CEVA, Inc. today announced an agreement to undertake joint research into the development of cellular modem technologies targeting next generation wireless baseband standards with NEC CASIO Mobile Communications, Ltd. ... read more |
| TI Demonstrates Android Development Platform Bringing ZigBee and ZigBee RF4CE to Smartphones and Tablets |
February 14, 201 -- At Mobile World Congress 2011, Texas Instruments, Inc. (TI) is showcasing an Android 2.2 software development platform, designed to simplify the mobile device integration of the ZigBee and ZigBee RF4CE protocol stacks. ... read more |
| ARM Processor Technology and ARM Partners Continue to Lead in Wireless Connectivity |
February 14, 2011 -- ARM and a number of its Partner Community, which includes all the leading silicon vendors in wireless connectivity, today highlighted their ongoing activity in baseband modem designs and momentum in the LTE and LTE-Ad ... read more |
| Five New AMD Opteron 6100 Series Processors Now Available for SE, Standard and HE Power Bands |
February 14, 2011 -- Advanced Micro Devices, Inc. (AMD) today announced the immediate availability of five new members of the AMD Opteron 6100 Series processor family that specifically address rising demand for low-power, balanced systems ... read more |
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