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 Category: News: News Archive 2011: Sunday, May 26, 2013
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Open-Silicon Introduces "On Time, or On Us" Program 

May 31, 2011 -- Open-Silicon, Inc. has introduced the semiconductor industry's first money-backed design engineering schedules. Open-Silicon will meet the schedule, delivering a prototype on time, or the company will refund the cost of th ... read more

Chipus Announces Ultra-Low-Power PMU IP for Portable Applications on LFoundry's 150-nm Technology 

May 31, 2011 -- Chipus Microelectronics has announced the immediate availability of a silicon-proven mixed-signal IP cores performing the functions of a PMU for ultra-low-power applications on LFoundry's advanced 150-nm mixed-signa ... read more

CAST Adds Video and Image Processing Cores to Compression IP Product Line 

May 31, 2011 -- CAST, Inc. has added new IP cores for image scaling, video deinterlacing, and graphics acceleration to its Video and Image IP core product line.

CAST already offers one of the broadest and deepest availab ... read more

Atrenta SpyGlass Used in TSMC Soft IP Qualification Flow 

May 26, 2011 -- Atrenta, Inc. today announced the deployment of a comprehensive soft IP qualification program using Atrenta's SpyGlass platform and a targeted subset of its GuideWare reference methodology in TSMC's IP-quality-asses ... read more

IME and TowerJazz Combine Expertise to Accelerate MEMS Device Industry Development 

May 25, 2011 -- The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR), has announced today its cooperation with TowerJazz projects in micro-electromechanical systems (MEMS), pack ... read more

3rd Asia Symposium on Quality Electronic Design (ASQED) Announces Program 

May 26, 2011 - The third Asia Symposium on Quality Electronic Design (ASQED) today announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations. A ... read more

Dongbu HiTek Joins the IPL Alliance 

May 25, 2011 -- The Interoperable PDK Libraries (IPL) Alliance announced today that Dongbu HiTek Co., Ltd. has joined the IPL Alliance. Dongbu HiTek plans to develop its first interoperable process design kit PDK (iPDK) for its BCD ... read more

PLDA Adds Chinese Distributors Comtech and Shanghai Jiatao Industrial 

May 26, 2011 -- PLDA has contracted with leading distributors Comtech and Jiatao Industrial to resell PLDA's line of leading interconnect IP for FPGA and ASIC. Today's announcement ensures that PLDA is perfectly positioned to support thei ... read more

Atrenta, Cadence and SpringSoft Sponsor Free Exhibits Floor Passes and "I LOVE DAC" Campaign  Featured

May 25, 2011 -- Offering a unique opportunity to enter the 48th Design Automation Conference (DAC) for free, Atrenta, Cadence, and SpringSoft are sponsoring three-day exhibits passes through the third annual "I LOVE DAC" campaign. The conference ... read more

Users Share Insights on System-Level Modeling, Design, and Verification of Embedded Systems at DAC 

May 25, 2011 -- The Open SystemC Initiative (OSCI) has announced events to be held during the 2011 Design Automation Conference (DAC) in San Diego, Calif.

Members of OSCI's Analog Mixed-Signal (AMS) Working Group will co ... read more

STMicroelectronics Increases MEMS Manufacturing Capacity 

May 25, 2011 -- STMicroelectronics is significantly increasing its MEMS production capacity to more than 3 million sensors a day, by the end of 2011 to sustain exploding customer demand for high-performance, cost-competitive sensing devic ... read more

Sibridge Technologies and Axiom Design Automation Partner to Integrate Verification IP with SystemVerilog  

May, 25 2011 -- Sibridge Technologies, a provider of design and verification IP, and Axiom Design Automation, provider of verification tools, today announced an agreement that will offer designers an integrated solution for accelerating S ... read more

Real Intent and Calypto Partner to Offer Integrated Tool Flow for RTL Power Optimization and Sign-Off 

May 25, 2011 -- Real Intent, Inc. and Calypto Design Systems, Inc. today announced that the companies are partnering to offer a seamless and interoperable flow between Real Intent's Meridian CDC and Ascent Lint products for registe ... read more

OCP-IP Develops New Relaxed Commercial Use License for SystemC Transaction Level Modeling Kit 

May 26, 2011 -- Open Core Protocol International Partnership (OCP-IP) today announced the availability of a relaxed version of its SystemC Transaction Level Modeling (TLM) Kit license. The new, commercial-use version of the license allows ... read more

NXP and Intrinsic-ID Demonstrate New Security Concept on NXP’s Security Chip Against Cloning and Counterfeiting 

May 25, 2011 -- NXP Semiconductors and Intrinsic-ID, a provider of security IP solutions, today announced the availability of a demonstration platform for the deployment of hardware intrinsic security (HIS) solutions based on Physi ... read more

Microsemi FPGAs Contribute to Smart Grid and Electric Vehicle Advances as Part of Ariane Controls Development Platform 

May 24, 2011 -- Microsemi SoC Products Group is working with Ariane Controls, a powerline communications developer, to provide FPGA technology for the industry's first development platform to support key emerging electric-vehicle charging ... read more

Micron Announces Sample Availability for Its Third-Generation RLDRAM Memory 

May 26, 2011 -- Micron Technology, Inc. today announced that early engineering samples are available for its third-generation reduced latency DRAM (RLDRAM3 memory). RLDRAM3 is a high-bandwidth memory technology that enables a more efficie ... read more

imec India Partners with Wipro to Bring Nanoelectronics Solutions to Emerging Markets 

May 25, 2011 -- imec today announced the establishment of IMEC India in Bangalore, Karnataka, making a first step towards serving the Indian market with the signing of an research and development partnership agreement with Wipro Technolog ... read more

eASIC Announces easicopy ASIC 

May 25, 2011 -- eASIC Corp. has announced the immediate availability of easicopy, an ASIC migration product that provides custom-chip designers with a simple, low-risk migration path from eASIC Nextreme and Nextreme-2 NEW ASICs to cell-ba ... read more

Chip Path Design Systems Unveils IP-Centric Design Approach to ASIC, FPGA and ASSP 

May 25, 2011 -- Chip Path Design Systems has announced details of its Semiconductor IP Chip Design approach. The new approach centers on one common Semantic-IC Specification with the ability to map to multiple implementation styles and un ... read more




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