March 8, 2012 -- The Semiconductor Manufacturing International Corp. (SMIC) today announced an ultra-high-density (UHD) library solution for its 0.11-µm Cu-BEoL (Copper Back End-of-Line) manufacturing platform that can reduce chip size by an average of 31%.
SMIC's comprehensive silicon-proven UHD IP solution incorporates SMIC's in-house UHD IP library, based on smaller bit cells, and Mentor Graphics Corp.'s cool-memory IP library with MemQuest memory compiler, specifically designed for compatibility with SMIC's UHD solution. SMIC's in-house UHD library consists of a 6-track UHD standard cell library, UHD memory compiler, and UHD standard I/O library. Mentor's UHD cool-memory IP library comprises coolSRAM-6T, coolREG-6T, coolREG-8T (Dual Port), coolREG-8T (Two Port), and coolROM. This unified library solution can generate different configurations to optimize power, speed, and density, and is available to SMIC customers free-of-charge.
SMIC's 0.11-µm UHD IP solution enables a 31% chip size reduction for a typical SOC design, when compared to a design that uses a traditional IP library. The silicon-proven ultra-high-density solution can be used in a wide range of applications, including mobile storage devices, Flash memory controllers, mobile multimedia players, digital televisions, and set-top boxes.
"Mentor Graphics is pleased to be able to offer its systemic, low-power and high density memory compiler technology to SMIC 0.11-µm users, to further optimize their design and embedded memory usage for additional density and cost gains," said Farzad Zarrinfar, Managing Director of the Novelics business unit at Mentor Graphics.
Go to the Semiconductor Manufacturing International Corp. (SMIC) website to find additional information.