August 29, 2005 -- The X Architecture represents the pervasive use of both Manhattan and diagonal interconnect on a chip. The interleaving of diagonal and Manhattan interconnect offers the ability to significantly reduce the amount of wiring and vias in a design.
This reduction allows designers to target smaller area or higher performance, improved yield and power savings. This is especially applicable in today’s market demands of ever-increasing functionality packaged in smaller, faster and cheaper ICs.
By Kalyan Thumaty and Robert Lipsey. (Thumaty serves as a Cadence Design Systems Vice President and General Manager, responsible for the X Architecture Division; Lipsey serves as the Methodology Architect, X Architecture, at Cadence Design Systems, Inc.)
This brief introduction has been excerpted from the original copyrighted article.