April 13, 2006 -- The system-on-a-chip (SoC) era has reached the point
where the assembly of such large, complex chips seems almost rote. From a high
level, it would appear to be a formula process: choose a processor, choose a
bus, bring together your memories and various peripherals, and that's about it.
But integrating semiconductor-intellectual property (IP)—the large functional
blocks that comprise these various major elements of an SoC—can indeed be a very
daunting task.
When contemplating what steps to take to simplify IP integration, three
things come immediately to mind. For one, it certainly helps if IP is packaged
and described in a standardized fashion. Then the broadest possible range of EDA
tools can readily accept it and be able to transfer those descriptions across
the design flow. For another, IP blocks must be able to communicate with each
other in the system context. Lastly, the quality and pedigree of IP blocks is
critical to design engineers.
In this article, we'll take a look at these aspects of IP integration.
There's been movement of late in the standards arena, as well as an upsurge in
IP quality. We'll look at the activities of the key organizations attempting to
bring about industry consensus on IP standards. New choices abound in terms of
tools, methodologies, and architectures for the interconnect, which is the
lifeblood of an SoC. We'll also look at IP from the perspective of an
implementation flow and the special challenges it can pose.
By David Maliniak, Electronic Design Magazine Senior
Editor.
This brief introduction has been excerpted from the original copyrighted article.
View the entire article on the Electronic Design Magazine website.