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Multicore SoCs Change Interconnect Requirements  
Publication: Electronic Engineering Times (EE Times)
Contributor: Freescale Semiconductor, Inc.
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October 20, 2008 -- The recent appearance of multicore system-on-chip (SoC) devices has rearranged the boundaries among silicon devices, boards and subsystems. This trend has led to significant changes in chip-to-chip and board-to-board interconnect requirements. Are existing standards-based interconnects ready for this transition?

By Greg Shippen. (Shippen is a system architect for the Networking Systems Division of Freescale Semiconductor, Inc.)

This brief introduction has been excerpted from the original copyrighted article.


View the entire article on the Electronic Engineering Times (EE Times) website.

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Freescale Semiconductor, Inc.
on SOCcentral.com

Keywords: Electronic Engineering Times (EE Times), Freescale Semiconductor, interconnect, system-on-chip, SoC, multicore processors, multi-core processors, microprocessors, MPUs,
580/27201 10/20/2008 5563 248


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