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Creating Virtual Platforms Using the OCP-IP Modeling Kit  
Publication: Design & Reuse
Contributor: GreenSocs
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June 10, 2010 -- An important use case for modeling of hardware IPs is to use the models to create Virtual Platforms. In a Virtual Platform, models of different IPs are stitched together, to be used to simulate the functionality of entire SOC (rather than mere components of a larger system). Different IPs have varied interface requirements, and connecting software models together can become a time consuming and error prone task, especially if the individual models use non-standard interfaces. The OCP-IP modeling kit provides a comprehensive resource that standardizes the way all IP that uses the OCP-IP bus interconnect is modeled greatly simplifying the difficulty in building virtual platforms.

This article presents work that has used the OCP-IP modeling kit, and shows the benefits that the kit brings.

Puneet Arora, Ruchir Bhartiand and Mark Burton. (Arora and Bharti are with CircuitSutra, and Burton is with GreenSocs.)

This brief introduction has been excerpted from the original copyrighted article.


View the entire article on the Design & Reuse website.

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GreenSocs
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Keywords: ASICs, ASIC design, FPGAs, field programmable gate arrays, FPGA design, EDA, EDA tools, electronic design automation, IP, intellectual property, cores, Design & Reuse, GreenSocs,
596/31612 6/17/2010 3132 240


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