The second International Workshop on Power Supply on Chip (PwrSOC’10), October 13-15, 2010, will bring together the key players from both the industry and academic communities active in the emerging area of system-in-package (SiP) and system-on-chip (SOC) solutions for power supply miniaturization. PwrSOC’10 plans to build on PwrSOC’08, which drew an international audience of over 120 experts from companies, universities, and research institutions.

Currently, significant R&D and product-development activity is evident in advances in semiconductor, magnetic, capacitor and packaging material technologies that will deliver products operating at multi-MHz frequencies. The ultimate target is to develop new miniaturized product formats that can be referred to as power supply-in-package (PSiP) and power supply-on-chip (PwrSoC). This space has been under increasing focus from semiconductor companies due to their ability to deliver advanced silicon processing technologies and functional integration with increased reliability. This proliferation of functionally-integrated hardware solutions can be seen as an inflection point in the power supply industry which is seeing a dramatic move away from traditional power supply manufacturing (with a focus on the assembly of power supply modules or bricks from discrete components) to an increasing emphasis on power supply products derived from semiconductor and microelectronics platforms and technologies.