January 26, 2011 -- This is an overview of the current state of 3D chips, or, in particular what has become known as 2D chips based on silicon interposer technology using through-silicon vias (TSVs). It is based on the keynotes at the 3D Architectures for Semiconductor Integration and Packaging Conference, December 8-10, 2010.
By Paul McLellan. (McLellan is an independent consultant, blogger at EDAgraffiti.com and Managing Editor of the DAC Knowledge Center.)
This brief introduction has been excerpted from the original copyrighted article.