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A Memory Subsystem Model for Evaluating Network-on-Chip Performance  
Company: OCP International Partnership (OCP-IP)
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Performance analysis of Network-on-Chip (NoC) architectures has traditionally been done by assuming dumb slaves that return responses either immediately or with a fixed delay. Typical system-on-chip architectures incorporating a NoC have high bandwidth communication to an external DRAM. In effect, the DRAM creates the performance bottleneck of the system. Correspondingly, performance analysis results that are presented without incorporating the DRAM controller and DRAM characteristics are likely to be overly simplistic and optimistic. Decisions that are made based on dumb slaves may lead to serious implications and system re-architecture late in the design cycle when actual DRAM memories fail to deliver the expected performance.

Creating a DRAM model for performance analysis may also not be very practical due to the sheer complexity of the DRAM controllers, and the need to adapt to newer DRAM technologies as they emerge. This paper provides a set of necessary parameters that can be used to generate a highly abstracted DRAM controller and memory. The objective is to keep the abstraction level high enough to make development easy, and at the same time, capture the critical parameters that significantly influence the performance of the system. The values of the parameters can be obtained from the JEDEC standards for the desired DRAM memory. Based on these values, the memory model can inject transaction specific latencies. This model is expected to help system architects get a more realistic picture of their system and thus help design the NoC as part of the system as opposed to treating the NoC in isolation.

By Krishnan Srinivasan and Erno Salminen. (Srinivasan is with Sonics, Inc. and Salminen is at the Tampere University of Technology.)

Access the entire document on the OCP International Partnership (OCP-IP) website.

E-mail OCP International Partnership (OCP-IP) for more information.

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Keywords: ASICs, ASIC design, IP, intellectual property, cores, on-chip interconnect, network-on-chip, NoC, embedded memory, Sonics, OCP International Partnership (OCP-IP),
205/33208 2/18/2011 1755 113
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