The System Level Interconnect Prediction (SLIP) Workshop, June 5, 2011, is co-located with the 48th Design Automation Conference. The general technical scope of the workshop is the design, analysis and prediction of intercommunication fabrics in electronic systems. Representative technical topics include:

Interconnect prediction and optimization at various IC design stages. Interconnect design challenges and system-level NoC design. Design and analysis of power and clock networks. Interconnect architecture of structural designs and FPGAs. Interconnect fabrics of many-core architectures. Design-for-manufacturing (DFM) techniques for interconnects. igh speed chip-to-chip interconnect design. Design and analysis of chip-package interfaces. Interconnect topologies of multiprocessor systems. 3D interconnect design and prediction, including through-silicon via (TSV) architecture and monolithic 3D stacking. Emerging interconnect technologies, e.g., RF interconnects, photonic networks, carbon-based interconnects, etc. Synergies between chip inter-communication networks and networks arising in other contexts such as social networks, system biology, etc.

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