The System Level Interconnect Prediction (SLIP) Workshop, June 5, 2011, is co-located with the 48th Design Automation Conference. The general technical scope of the workshop is the design, analysis and prediction of intercommunication fabrics in electronic systems. Representative technical topics include:
Interconnect prediction and optimization at various IC design stages.
Interconnect design challenges and system-level NoC design.
Design and analysis of power and clock networks.
Interconnect architecture of structural designs and FPGAs.
Interconnect fabrics of many-core architectures.
Design-for-manufacturing (DFM) techniques for interconnects.
igh speed chip-to-chip interconnect design.
Design and analysis of chip-package interfaces.
Interconnect topologies of multiprocessor systems.
3D interconnect design and prediction, including through-silicon via (TSV) architecture and monolithic 3D stacking.