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International Conference on VLSI and System-on-Chip (VLSI-SoC)   Featured
Sponsor: IEEE Circuits & Systems Society
Location: Kowloon, HONG KONG  
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The International Conference on VLSI and System-on-Chip (VLSI-SoC), October 3-5, 2011, is the 19th in a series of international conferences sponsored that explores the state-of-the-art and the new developments in the field of very large scale integration (VLSI), system-on-chip (SoC) and their designs. The purpose of VLSI-SoC is to provide a forum to exchange ideas, and show industrial and research results in the fields of VLSI/ULSI Systems, SoC design, VLSI CAD and Microelectronic Design and Test. This edition special emphasis is given to the research area of "SoC design for ubiquitous sensing and computing".

Topics include:
  • Analog, digital, and mixed-signal IC design
  • 3-D integration and physical design
  • Circuits and systems for micro-sensing applications
  • Deep submicron design and modeling issues
  • New devices and MEMS
  • CAD and tools, testability and design for test
  • Digital signal processing and image processing IC design
  • Prototyping, validation, and verification
  • Modeling and simulation
  • System-on-chip design
  • Embedded systems design and real-time systems
  • New architectures and compilers
  • Reconfigurable systems
  • Low-power and thermal-aware design
  • Green computing
  • Logic and high-level synthesis
  • New applications (communications, biosystems, automobile, security, sensor networks, etc.)


Go directly to sponsor site for complete conference details.

Keywords: ASICs, ASIC design, custom IC design, 3D ICs, 3D chips, stacked ICs, EDA, EDA tools, electronic design automation, microelectromechanical systems, micro-electro-mechanical systems, MEMS, IEEE Circuits & Systems Society,
351/33327 10/3/2011 2778 2170


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