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Minimizing Yield Fallout by Avoiding Over and Under At-Speed Testing  
Publication: EE Times Embedded
Contributor: Advanced Micro Devices, Inc. (AMD)
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September 30, 2011 -- In the nanometer technology used for automotive SOCs, most defects on silicon are due to timing issues. Thus, at-speed coverage requirements in automotive designs are stringent. To meet these requirements, engineers expend a lot of effort to get higher at-speed coverage. The principle challenge is to achieve silicon of the desired quality with high yield at the lowest possible cost.

In this article we discuss the problems associated with over-testing and under-testing in at-speed testing, which can result in yield issues. We will provide a few suggestions that can help to overcome these problems.

By Rajiv Mittal and Amol Agarwal. (Mittal works at Advanced Micro Devices (AMD) as Senior Member of Technical Staff in ASIC/Layout Design Team in India; Agarwal is a Senior Design Engineer at Freescale Semiconductor, Inc.)

This brief introduction has been excerpted from the original copyrighted article.


View the entire article on the EE Times Embedded website.

Read more about
Advanced Micro Devices, Inc. (AMD)
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Keywords: ASICs, ASIC design, EDA, EDA tools, electronic design automation, design for manufacturing, design-for-manufacturing, DFM, design for test, design-for-test, DFT, design for yield, design-for-yield, DFY, EE Times Embedded, Advanced Micro Devices (AMD)
599/34905 9/30/2011 625 79


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