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Testbench Generation for Multi-Chip Modules and 3D Chips  
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November 3, 2011 -- GOEPEL electronic GmbH has announced the availability of additional features in its TAPChecker EDA software for the generation of BSDL testbenches. The newly developed options extend the software's flexibility in terms of handling pin groups and complex port declarations for improved coverage of multi-chip modules and 3D chips. Users are now able to assign special vector sequences to complete port groups or to adopt complex bus structures into the simulation.

TAP Checker is based on modular platform architecture with a central database and individual licensed modules for data import/ export and automatic test vector generation. The software was designed for automatic testbench generation for simulations based on BSDL files as well as provision of test vectors for in-circuit testers. It can be utilized in various operating systems such as Solaris, Windows And LinuX, supporting the boundary scan standards IEEE 1149.1 and IEEE 1149.6.

The new features are available from TAPChecker V. 2.2 on. The release is already shipping, free-of-charge for users with valid maintenance contract.

Go to the GOEPEL electronic GmbH website for details.

E-mail GOEPEL electronic GmbH for more information.

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GOEPEL electronic GmbH
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Keywords: PCB design, 3D ICs, 3D chips, stacked ICs, multi-chip modules, MCMs, EDA, EDA tools, electronic design automation, PCB/MCM tools, testbench generation, GOEPEL electronic, TAPChecker
600/35265 11/3/2011 571 72


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