February 22, 2012 -- The increasing opportunities and requirements for system-in-package (SiP) technologies have become a driving force in the electronics and semiconductor industry. A number of companies are focused on maximizing the benefits and meeting the challenges that SiP brings.
Some SiP technologies, such as wirebonded multi-chip modules and advanced MCMs, have been around for decades; others, such as package-on-package stacking, are more recent. Such newer technologies as 2.5-D interposers and 3-D through-silicon via (TSV) can bring new challenges along with new capabilities.
By Matt Romig and Vikas Gupta. (Romig is packaging technology productization manager for Texas Instruments, Inc. Analog. Gupta is a packaging engineer in the Application Specific Products Group at TI.)
This brief introduction has been excerpted from the original copyrighted article.