May 22, 2012 -- DOCEA Power announced that it is shipping Aceplorer 3.0 with an event scheduler for enhanced scenario-creation capabilities and support for thermal models generated by its AceThermalModeler for coupled power- and thermal-simulation capabilities. In addition, it is announcing AceThermalModeler 1.1 with an enhanced 3D viewer for fast model debugging.

Aceplorer models and optimizes power and thermal consumption for early architecture exploration, architecture validation and power budget tracking during design implementation stages, and AceThermalModeler creates compact RC thermal models for complete systems from system-on-chips (SOCs) to system-in-packages (SiP), and 3D ICs to complete boards. These compact thermal models are used for fast steady state or dynamic thermal responses enabling early system floorplan exploration or partitioning, improved system packaging and integration architectures, and early exploration of power- and thermal-management policies to reduce temperature peaks and manage temperature gradients across the system.

Aceplorer 3.0's new features include an event scheduler to automate the creation of timed scenarios from parallel tasks and workload definitions with different arbitration schemes, along with the support for thermal models created with AceThermalModeler. The event scheduler complements the existing timed flow chart creation and vcd-import capabilities already in place and used to automate the creations of use-cases.

AceThermalModeler 1.1 will be demonstrated for the first time at DAC, June 4-6, Booth #1702. Its new features include an enhanced graphical user interface (GUI) with capabilities for 3D and thermal model creation and debugging. The DOCEA team will demonstrate how to use its thermal models to validate thermal management policies, simulate power-thermal coupling, detect thermal runaway risks, and improve the productivity of thermal experts and the architecture team.