June 15, 2012 -- The Microsemi SoC Products Group today announced that its field programmable gate arrays (FPGAs) and SmartFusion customizable system-on-chip (cSoC) solutions are now characterized at extreme operating temperatures ranging from 150°C to 200°C. The devices have already been deployed in down-hole drilling products, space systems, avionics equipment and other applications requiring high performance and the utmost reliability in extreme low- and high-temperature environments.
The following Microsemi products are now available in extreme operating temperature ranges: SmartFusion (A2F), Fusion (AFS), ProASIC3 (A3P), IGLOO (AGL), (APA), SX-A, MX, ACT1, 2, 3.