Page loading . . .

  
 You are at: The item(s) you requested.Wednesday, May 22, 2013
SMIC and AlgolTek Announce Availability of digniPHY for USB 3.0 on SMIC's 0.13-µm Technology  
 Printer friendly
 E-Mail Item URL

June 20, 2012 -- The Semiconductor Manufacturing International Corp. (SMIC) and AlgolTek, Inc. today announced the availability of digniPHY for USB 3.0 on SMIC's 0.13-micron process technology.

AlgolTek's digniPHY for USB 3.0 is a Physical Layer IP compliant with the USB 3.0 specification, and is backward compatible to support third-party or customers' proprietary USB 2.0 IP that is USB 2.0-specification compliant. digniPHY is the first product in AlgolTek's SuperSpeed IP portfolio to leverage SMIC's 0.13-micron technology node, providing a balance of high performance, lower power consumption and cost-effective manufacturing.

The newly released digniPHY for USB 3.0 IP has also passed the USB-logo compliance test suite, including the USB 3.0 Electrical Test, Link Layer Test and Interoperability Test at the system level.



Go to the AlgolTek, Inc. website to find additional information.

E-mail AlgolTek, Inc. for more information.

Read more about
AlgolTek, Inc.
and
Semiconductor Manufacturing International Corp. (SMIC)
on SOCcentral.com


Keywords: ASICs, ASIC design, IP, intellectual property, cores, Universal Serial Bus, USB, AlgolTek, Semiconductor Manufacturing International Corp. (SMIC)
601/38734 6/20/2012 431 61


Designer's Mall
0.3945313



Copyright 2002 - 2004 Tech Pro Communications, P.O. Box 1801, Merrimack, NH 03054
 Search site for:
    Search Options

Subscribe to SOCcentral's
SOC Explorer
Newsletter
and receive news, article, whitepaper, and product updates bi-weekly.

Exec Viewpoint

Maximizing the Value of Your Internal IP


Warren Savage
CEO, IPextreme

Exec Viewpoint

Yes, Virginia,
There Is a
Stitch-and-Ship


Dave Johnson
VP of Sales
Breker Verification

Odd Parity

Lets' Go On
with the Show!


Mike Donlin
The Write Solution

Odd Parity Archive

Barbara's Bytes

So, Just What
Is ESL


Barbara Tuck
Senior Editor,
SOCcentral

SOCcentral Job Search

SOC Design
ASIC Design
ASIC Verification
FPGA Design
CPLD Design
PCB Design
DSP Design
RTOS Development
Digital Design

Analog Design
Mixed-Signal Design
DFT
DFM
IC Packaging
VHDL
Verilog
SystemC
SystemVerilog

Special Topics/Feature Articles
3D Integrated Circuits
Analog & Mixed-Signal Design
Design for Manufacturing
Design for Test
DSP in ASICs & FPGAs
ESL Design
Floorplanning & Layout
Formal Verification/OVM/UVM/VMM
Logic & Physical Synthesis
Low-Power Design
MEMS
On-Chip Interconnect
Selecting & Integrating IP
Signal Integrity
SystemC
SystemVerilog
Timing Analysis & Closure
Transaction Level Modeling (TLM)
Verilog
VHDL
 
Design Center
Whitepapers & App Notes
Live and Archived Webcasts
Newsletters


About SOCcentral.com

Sponsorship/Advertising Information

The Home Port  EDA/EDA Tools  FPGAs/PLDs/CPLDs  Intellectual Property  Electronic System Level Design  Special Topics/Feature Articles  Vendor & Organization Directory
News  Major RSS Feeds  Articles Online  Tutorials, White Papers, etc.  Webcasts  Online Resources  Software   Tech Books   Conferences & Seminars  About SOCcentral.com
Copyright 2003-2013  Tech Pro Communications   1209 Colts Circle    Lawrenceville, NJ 08648    Phone: 609-477-6308
1  0.4648438