June 20, 2012 -- The Semiconductor Manufacturing International Corp. (SMIC) and AlgolTek, Inc. today announced the availability of digniPHY for USB 3.0 on SMIC's 0.13-micron process technology.
AlgolTek's digniPHY for USB 3.0 is a Physical Layer IP compliant with the USB 3.0 specification, and is backward compatible to support third-party or customers' proprietary USB 2.0 IP that is USB 2.0-specification compliant. digniPHY is the first product in AlgolTek's SuperSpeed IP portfolio to leverage SMIC's 0.13-micron technology node, providing a balance of high performance, lower power consumption and cost-effective manufacturing.
The newly released digniPHY for USB 3.0 IP has also passed the USB-logo compliance test suite, including the USB 3.0 Electrical Test, Link Layer Test and Interoperability Test at the system level.
Go to the AlgolTek, Inc. website to find additional information.