As clock speeds increase into the gigaHertz regime and
rise times decrease into the picosecond regime, the interaction
between capacitors and power/ground planes of a package on
which they are mounted becomes vitally important to the
performance of a power delivery system. To include the
interaction between the capacitor and the package, a 3D
distributed model is proposed to more accurately evaluate the
total loop inductance of a capacitor mounted on pads over vias
connected to power/ground planes. The comparison of loop
inductance modeling methods based on one-plane and twoplane
models using various modeling tools is given. The
modeled data match well with the measured data. After
validating the distributed capacitor models, performance
evaluation of the complete power delivery system based on a
lumped and a distributed model of capacitors is made.
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